Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template
Brands: Chipsetpro.com
5,40 €
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template
N13EGS1LPA1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
N13E-GS1-LP-A1 Stencil Template 90*90
6in1 Stencil Template BGA153 162 169 186 221 254 EMCP EMMC
Brands: Chipsetpro.com
9,82 €
6in1 Stencil Template BGA153 /162 /169 /186 /221 /254 EMCP EMMC
AM950BADY23AB Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
AM950BADY23AB Stencil Template 90*90