Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003585
Nessuna opinione al momento
16 other products in the same category
11pcs iphone5 iphone Modello X Stencil
Brands: Chipsetpro.com
19,89 €
11pcs iphone5 - iphoneX Stencil Template
i74760HQ SR1BM Stencil Template 90x90
Brands: Chipsetpro.com
9,94 €
I7-4760HQ SR1BM Stencil Template 90*90
I5-6440EQ SR2DU Stencil Template 90*90
