Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003666
Nessuna opinione al momento
16 other products in the same category
i57300U SR340 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i5-7300U SR340 Stencil Template 90*90
N13EGS1LPA1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
N13E-GS1-LP-A1 Stencil Template 90*90
i35010U SR23Z Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
I3-5010U SR23Z Stencil Template 90*90
i34030U SR1EN Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i3-4030U SR1EN Stencil Template 90*90
i52450M SR06Z Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-2450M SR06Z Stencil Template 90*90
BD82HM65 SLJ4P Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
BD82HM65 SLJ4P Stencil Template 90*90
GF-GO7600T-N-B1 Stencil Template
