Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003952
Nessuna opinione al momento
16 other products in the same category
i32375M SR0U4 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i3-2375M SR0U4 Stencil Template 90*90
i73667U SR0N5 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i7-3667U SR0N5 Stencil Template 90*90
SR0FB Pentium DualCore Modello mobile Stencil 90x90
Brands: Chipsetpro.com
17,14 €
SR0FB Matium Dual-Core Mobile Stencil Template 90*90
N14EGTXWA2 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
N14E-GTX-W-A2 Stencil Template 90*90
GL82H110 SR2CA Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
GL82H110 SR2CA Stencil Template 90*90
G86-731-A2 Stencil Template
