J2900 SR1US Stencil Template
Part Number intel CPU Stencil Manufacturer ATK
Stencil Template Direct heating Metal 304 Stainless steel
Package/Case 1 PCS Description Buik new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004079
Nessuna opinione al momento
16 other products in the same category
N16EGSKABA1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
N16E-GS-KAB-A1 Stencil Template 90*90
BD82HM65 SLH9D Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
BD82HM65 SLH9D Stencil Template 90*90
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
Brands: Chipsetpro.com
9,82 €
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
J2900 SR1US Stencil Template
