Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004384
Nessuna opinione al momento
16 other products in the same category
GP104200A1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GP104-200-A1 Stencil Template 90*90
i32365M SR0U3 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i3-2365M SR0U3 Stencil Template 90*90
Kit di stazione di SR3RZ Stencil Solder
Brands: Chipsetpro.com
36,67 €
Kit di stazione di SR3RZ Stencil Solder
i32350M SR0DQ Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
i3-2350M SR0DQ Stencil Template 90*90
N4200 SR2Z5 Stencil Template 90*90
