Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004416
Nessuna opinione al momento
16 other products in the same category
i32370M SR0DR Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
I3-2370M SR0DR Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90*90
BGA153 Kit Stazione Solder Stencil
Brands: Chipsetpro.com
24,86 €
BGA153 Kit Stazione Solder Stencil
N11P-LP-A1 Stencil Template
