Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004614
Nessuna opinione al momento
16 other products in the same category
i57442EQ SR34U Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-7442EQ SR34U Stencil Template 90*90
i33110M SR0N2 Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
i3-3110M SR0N2 Stencil Template 90*90
J5005 SR3S3 Stencil Template 90x90
Brands: Chipsetpro.com
14,92 €
J5005 SR3S3 Stencil Template 90*90
I7-6820HK SR2FL Stencil Template 90*90
