

Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
I5-8350U SR3L9 Stencil Template 90*90
BD82HM67 SLJ4N Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template
GL512 GL256 GL064 GL032 BGA64 BGA64 Stencil Template
BD82C602 SLJKG Stencil Template 90*90
THGBM4G4D1HBA1R BGA153 Stencil Template
ODNX02-A2 Stencil Solder Station Kits