Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004847
Nessuna opinione al momento
16 other products in the same category
3955U SR2EW Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
3955U SR2EW Stencil Template 90*90
FM980PADY44AB Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
FM980PADY44AB Stencil Template 90*90
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
Brands: Chipsetpro.com
7,46 €
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
i74700HQ SR15E Stencil Template 90x90
Brands: Chipsetpro.com
17,81 €
I7-4700HQ SR15E Stencil Template 90*90
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
Brands: Chipsetpro.com
9,82 €
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
i53317U SR0N8 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
I5-3317U SR0N8 Stencil Template 90*90
GF110-827-A1 Stencil Template
