Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Universal 27pcs 90mm*90mm Stencil Template+BGA Stazione di Solder
i7-2637M SR0D3 Stencil Template 90*90
I5-7442EQ SR34U Stencil Template 90*90
N16E-GS-KAB-A1 Stencil Template 90*90
I5-5200U SR23Y Stencil Template 90*90
