Please note: Due to too many models, the factory can only guarantee 90% model accuracy, about 10% error, please understand!

0.25mm (pitch=0.5mm)

0.3mm (pitch=0.58mm)

0.3mm (pitch=0.5mm)

0.35mm (pitch=0.65mm)

0.35mm (pitch=0.6mm)

0.4mm (pitch=0.7mm)

0.45mm (pitch=0.78mm)

0.5mm 35*35 (pitch=0.78mm)

0.5mm 40*40 (pitch=0.81mm) 0.5mm (pitch=0.8mm)

0.55mm (pitch=1.02mm)

0.6mm (pitch=0.9mm)

0.6mm 24*24 (pitch=0.99mm)

0.6mm (pitch=1.0mm)

0.6mm 27*27 (pitch=0.99mm)

0.6mm (pitch=1.1mm)

0.6mm 30*30 (pitch=0.99mm)

0.6mm 33*33 (pitch=0.99mm) 0.6mm 41*41 (pitch=1.01mm)

0.65mm (pitch=1.0mm)

0.76mm 30*30 (pitch=1.27mm)

0.76mm 33*33 (pitch=1.27mm)

0.76mm 34*34 (pitch=1.27mm)

0.76mm 37*37 (pitch=1.27mm)

0.76mm 41*41 (pitch=1.27mm)

0.76mm (pitch=1.27mm)

1.0mm (pitch=1.5mm)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock