Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005065
Nessuna opinione al momento
16 other products in the same category
SONY PS4 CXD90026G Stencil Template
Brands: Chipsetpro.com
5,40 €
SONY PS4 CXD90026G Stencil Template
i57300U SR340 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i5-7300U SR340 Stencil Template 90*90
J4105 SR3S4 Stencil Template 90x90
Brands: Chipsetpro.com
14,92 €
J4105 SR3S4 Stencil Template 90*90
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258BN Stencil Template
Brands: Chipsetpro.com
9,82 €
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template
3955U SR2EW Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
3955U SR2EW Stencil Template 90*90
I7-4760HQ SR1BM Stencil Template 90*90
