Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
i56300HQ SR2SK Stencil Template 90x90
I5-6300HQ SR2SK Stencil Template 90*90
Pentium Dual Modello principale SR0FB Stencil
Modello di Stencil SR0FB SR0FB Dual-Core
i72617M SR03T Stencil Template 90x90
I7-2617M SR03T Stencil Template 90*90
Pentium DualCore Mobile 987 SR0V4 Stencil Template
Pentium Dual-Core Mobile 987 SR0V4 Stencil Template
i56440EQ SR2DU Stencil Template 90x90
I5-6440EQ SR2DU Stencil Template 90*90
FNP102B1E01 FNP102B1E31 Stencil Template
FNP102-B1E01 FNP102-B1E31 Stencil Template