Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005084
Nessuna opinione al momento
16 other products in the same category
i74510U SR1EB Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I7-4510U SR1EB Stencil Template 90*90
i56267U SR2JK Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
I5-6267U SR2JK Stencil Template 90*90
ODNX02A2 Stencil Solder Station Kit
Brands: Chipsetpro.com
36,67 €
ODNX02-A2 Stencil Solder Station Kits
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90*90
i77700HQ SR32Q Stencil Template 90x90
Brands: Chipsetpro.com
13,23 €
I7-7700HQ SR32Q Stencil Template 90*90
LGE3556C Stencil Template
