Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005143
Nessuna opinione al momento
16 other products in the same category
GTX1060 N17EG1A1 Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
GTX1060 N17E-G1-A1 Stencil Template 90*90
J4105 SR3S4 Stencil Template 90x90
Brands: Chipsetpro.com
14,92 €
J4105 SR3S4 Stencil Template 90*90
BD82HM67 SLJ4N Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
BD82HM67 SLJ4N Stencil Template 90*90
N17PG1BKCA1 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
N17P-G1-B-KC-A1 Stencil Template 90*90
i56300U SR2F0 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i5-6300U SR2F0 Stencil Template 90*90
G86-621-A2 Stencil Template
