Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

Chipsetpro.com

Chipsetpro.com

1.0mm Blue GPU CPU Heatsink Silicone Compound Thermal Conductive Pad

Part Number Compound Thermal Conductive Pad Manufacturer ZTK

Ingredients Silicone Date Code 16+

Size 100*100*1.0mm Description Bulk new

Chipsetpro.com

Chipsetpro.com

10mm*30m Single Conductive COPPER FOIL TAPE Electronic Tool

Part Number Copper Foil Tape Material CU 99.98%

Side One Sided Conductive Heat Resistance -10 ?~120 ?

Adhesion Single sided adhesive Size 10mm*30m

Chipsetpro.com

Chipsetpro.com

10mm*33m Kapton Nastro ad alta temperatura resistente al calore Polyimide

Numero parte Kapton nastro ad alta temperatura resistenza al calore 220?~300?

Peso 28g Tipo Kapton Nastro

Pacchetto/Case 1 PC Larghezza e lunghezza 10mm*33m

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

11# SATA Hard Disk Power Line Transfer Line 4 pin IDE to SATA serial Connection Line

Chipsetpro.com

Chipsetpro.com

Buy : * Soldering iron head

Chipsetpro.com

Chipsetpro.com

Buy : * Soldering iron head

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

100% nuovi e di alta qualità

Il rame ha un elevato coefficiente di purezza di conducibilità termica fino a 407 w/ (m?K)

Con questo cuscinetto di rame per abbassare notevolmente le temperature della GPU, può essere utilizzato per la grafica, Northbridge, chip della CPU.

Può essere applicato a HP, Dell, Acer, Thinkpad e tutta la soluzione portatile e dissipatore di computer!

Materiale: Rame

Colore: Come l'immagine

Dimensioni: circa 1.2T x 15 x 15 (T*L*W)

Come usare: Prima daub un po 'di grasso termico in silicone (FYI: Non utilizzare il grasso in silicone di fascia bassa), poi mettere le punte di rame di giusta dimensione, poi daub un po 'di grasso in silicone termico di nuovo, ultimo installare il dissipatore e stringere le viti

Chipsetpro.com

Chipsetpro.com