Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Cavo LVDS per schermo Asus X551CA D550C F551M p/n: 14005-01070000 14005-01070100 14005-01070200
rPGA947 Connettore CPU SOCKET BGA Base
T13-BC1 BaKon integrato nucleo di riscaldamento senza piombo portatile 75W costante temperatura saldante nucleo di ferro
Cavo LVDS per schermo Acer 5635 LED p/n: dd0zr6lc100
tastiera wireless Bluetooth Ultra Slim per iPad/Windows OS/Mac/Android
COOLCOLD Notebook radiatore di scarico Devil4
Microscopio elettronico digitale HD 2K 48MP 1080P Fotocamera HDMI USB C Mount Macchina fotografica industriale per telefono PCB Solder riparato
Cavo LVDS per schermo Dell 5720 7720 p/n DD0R09LC000 DD0R09LC010 DD0R09LC020 DD0R09LC030 DD0R09LC060 DD0R0R0
Laird T-FLEX700/740 GPU CPU Graphics Card Heat Dissipation Efficient Pad
HAYEAR HY-5300 16MP 1080P 60FPS microscopio digitale HDMI USB 150X
Cavo LVDS per schermo Dell N5030 M5030 N5020 15V P/N: 50.4EM03.101 042CW8 50.4EM03.001 50.4EM03.
Cavo LVDS per schermo HP DV7-6000 p/n: 50.4RN10.012
SATlink WS-6906 DVB-S FTA Data Digital Satellite Signal Finder Meter HD 3.5LCD
Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad 34*23cm
Cavo LVDS per schermo HP CQ60 G60 16 LCD P/N: 50.4AH15.001 50.4AH16.001 496841-001
Desolding Goot Wick CP-1515 Giappone originale RoHS
10g Giappone goot BS-10 BGA Ripristino della riparazione Flux pasta
