Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Cavo LVDS per schermo Toshiba A300 p/n: DD0BL5LC000 DD0BL5LC100 DD0BL5LC300 GLEDD0BL5LC000
Colla multifunzionale B-7000 per telefono cellulare universale
0,15 mm Pinzette antimagnetizzazione lega di titanio Tipo di marcia
Cavo LVDS per schermo Acer E1-521 E1-531 E1-571 V3-571 p/n: DC02001F010 40pin
QIANLI-007 Chip Riparazione Tool Set CPU Scraper Removal Chip
BaKon 950D saldante saldatore ferro 220V/50W riscaldamento interno tipo
15.6-17.3LED Convertitore di schermo Cavo da sinistra a destra 40PIN
Andonstar ADSM201 HDMI 1080 Digital Microscope Electronics Inspection PCB Riparazione
Cavo LVDS per schermo Samsung NP350E7C p/n: DC02001KP00
QIANLI-008 Chip Riparazione Tool Set CPU Scraper Removal Chip
Batteria per Samsung R425 R428 R430 R520 (11.1V 7800mAh) AA-PB9NC5B AA-PB9NC6B AA-PB9NC6W
Batteria per Samsung NC10 AA-PB1TC6B AA-PB6NC6W AA-PB6NC6WE AA-PB6NC6W
CM141 senza piombo in lega di titanio Solder Soldering Pot Vasca da bagno di discesa 900W 220V
Cavo LVDS per schermo Acer 5742 5742G LED p/n:DD0ZRDLC030
Modulo di Transceiver Bluetooth RF wireless Serial 6 Pin HC-05 RS232 Maestro Slave
Cavo LVDS per schermo HP 15-e000 p/n: DD0R65LC00
Foxconn Portable Motherboard Socket 754 Base BGA
