Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Batteria per Sony VAIO VGP-BPS13 (11.1V 4400mAh)
Cavo LVDS per schermo Asus K52 LCD p/n: 1422-00rl000
Cavo LVDS per schermo HP 450 G1 p/n: 50.4YX01.001
15ml multifunzionale adesivo colla B-7000 per telefono cellulare universale
2.0m OMEGA K-TYPE Termocoppia TT-K-30-SLE
Batteria per Samsung R425 R428 R430 R510 R519 R520 R525 R580 (11.1V 5200mAh)
Universale 12.7mm SATA 2nd SSD HDD Hard Drive Caddy per DVD-ROM CD Optical Bay
900M-T-1.6D KINGBOX 936 testa di saldatura senza piombo testa termostatica
Laird T-FLEX700/760 GPU CPU Graphics Card dissipazione del calore Efficiente Pad
Nastro in alluminio 50mm*40m Roll Ideale per la refrigerazione del calore
T13-C4 Ba Kon riscaldamento integrato nucleo senza piombo portatile 75W costante temperatura saldante ferro core
Batteria per ASUS X58 ASUS X51 (11.1V 4400mAh) PN A32-X51 A32-T12
T13-BL BaKon nucleo di riscaldamento integrato senza piombo portatile 75W costante temperatura saldante nucleo di ferro
LVS Cavo Dell Inspiron N5050 M505050 N5040 M5040 3520 05WXP2 CN-05WXP2
CP-3515 Goot Wick Desoldering
