
25mm blu GPU CPU Heatsink Silicone Compound Thermal Conductive Pad
2.5mm Blue GPU CPU Heatsink Silicone Compound Thermal Conductive Pad
Dinghua Model:DH-A1L-C BGA rework station
Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual
Specification:
Total Power 4900W
Top heater 800W
Bottom heater Second heater 1200W,IR preheating
2700w, digital thermostat soldering iron
80W
Power AC220V10% 50/60Hz
Dimensions L650W700H650 mm
Positioning V-groove, PCB support can be adjusted in any direction with
external universal fixture
Temperature control K Sensor, Closed loop
Temp accuracy 1?
PCB size Max 500450 mm Min 2222 mm
BGA chip 22-8080mm
Minimum chip spacing 0.15mm
External Temperature Sensor 1(optional)
Net weight 55kg
Feature:
1.Embedded Industrial PC, high definition touch screen interface, PLC control, and
instant profile analysis function. Real-time settings and actual temperature profile
display can be used to analyzed and correct parameters if necessary.
2.It uses precise K-type close circuit control and automatic temperature adjustment
system, with PLC and temperature module to enable precision temperature control of
1 deg C. External temperature sensor enables temperature monitoring and accurate
analysis of real time temperature profile.
3.V-groove PCB support for rapid, convenience and accurate positioning that fits for
all kinds of PCB board.
4.Flexible and convenient removable fixture on the PCB board which protects and
prevent damage to PCB. It can also adapt to rework various BGA packages.
5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy
installation and replacement;
6.Three temperature areas can independently heat and are multiple controllable and
adjustable to ensure best integration of different temperature areas. Heating
temperature, time, angle, cooling and vacuuming can all be set on the interface.
7.There are 6-8 levels of variable and constant temperature controls. Massive storage
of temperature curves which are Instant accessible according to different BGA. Curve
analysis, setting and adjustment are all accessible via touch screen. Three heating
areas adopts independent PID calculation to control heating process to enable more
accurate and precise temperature control.
8.It uses high powered blower to enable fast cooling of PCB board and prevent it from
deformation. There are also internal vacuum pump and external vacuum pen to assist
with fetching the BGA chip.
9.Laser positioning, fast and effectively fix PCB
10.USB output interface.
11.Equipped with constant temperature digital display soldering iron
12.Including Voice "early warning" function. 5-10 seconds before the completion of
uninstalling or welding, voice reminder / warning to get the workers prepared.
Cooling system will start after vertical wind stopped heating. When the temperature
drops to room temperature, the cooling process will stop, so that the machine will not
age after
heated up.
13.HD Display screen+camera + support. With the equipment, we can see the
melting ball of outermost row very clear.
14.CE certification, with emergency switch and automatic power-off protection
device when emergency happens.
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