Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
15mm*33m Kapton Nastro ad alta temperatura resistente al calore Polyimide
Laird T-FLEX700/740 GPU CPU Graphics Card Heat Dissipation Efficient Pad
Desoldering Goot Wick CP-2015 Giappone originale RoHS
Cavo LVDS per schermo Dell N5040 N505050 M5040 V1550 P/N: 50.4IP02.001 50.4IP02.302 50.4IP02.002
Cavo LVDS per schermo Acer E1-521 E1-531 E1-571 V3-571 p/n: DC02C004600 30pin
7pcs VETUS ESD Attrezzi di riparazione dell\'acciaio inossidabile antistatico sicuro
1,0 m OMEGA K-TYPE Termocoppia TT-K-30-SLE
Manipolazione sottovuoto Strumento HANDI-VAC KIT-ESD
5.0m OMEGA K-TYPE Termocoppia TT-K-30-SLE
CM100S Vasca di desoldering 500W 220V senza piombo in lega di titanio
Cavo LVDS per schermo Samsung NP300E5C NP300E5Z NP305E5A p/n: BA39-01166A
Nastro in alluminio 60mm*40m Roll Ideale per la refrigerazione del calore
Cavo LVDS per schermo Asus K56 A56 S56 p/n: 1422-019W000 14005-00600000 14005-00600100
Cavo LVDS per schermo Asus K43 X43 X44 p/n: DD0KJ2LC000
Interruttore di pressione YUKEN JT-02-200-11
1m cavo SAS sata Mini-SAS SFF-8087 a 4 cavi SATA Mini SAS 4i SFF8087 36P a 4 SATA 7P Linea di cavi Hard Disk
BGA 5302F LGA775 Intel Presa della scheda madre
