Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Manipolazione sottovuoto Strumento HANDI-VAC KIT-ESD
Cavo LVDS per schermo Acer ES1-512 ES1-531 ES1-571 p/n: 450.03704.0001 450.03704.0011 450.03704.
Cavo LVDS per schermo HP Elitebook 6930p p/n: 50.4V907.001 50.4V907.002 50.4V907.004 50.4V920.0
Ventola di raffreddamento per Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90
Cavo LVDS per schermo Samsung NC10 ND10 P/N: BA39-00766A BA39-00784A
Cavo LVDS per schermo Lenovo G470 G475 P/N: DC020015T10 PIWG
HAYEAR HY-5300 16MP 1080P 60FPS microscopio digitale HDMI USB 150X
AOYUE 968A+ 3in1 rework station pistola ad aria calda + saldatrice + ammortizzatore
Batteria per HP Pavilion G42 G62 DV6-6000 G6 (11.1V 5200mAh) p/n HSTNN-Q60C HSTNN-Q61C HSTNN-Q62
Cavo LVDS per schermo Lenovo G50-45 G50-70 G50-30 Z50-70 Z50-45 Ver.2 p/n: DC02001MH00
FOXCONN CPU Sockel mPGA 479M presa BGA
lettore di schede ad alta velocità USB2.0 MS.CF.TF.SD 6in1
Cavo LVDS per schermo Acer One D250 LED p/n: DC02000SB10 DC02000SB00 DC02000SB50
UNO R3 ATmega328P CH340 Mini USB Consiglio per FF compatibile-Arduino
JBC C245-030 Testa di ferro saldante
DF40HC(3.0)-40DS-0.4V(51) connettore di presa
Socket LGA1156 CPU Base 1156 PC connettore BGA Base
