IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer strumento per saldare il saldatore del saldatore del saldatore
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer strumento per saldare il saldatore del saldatore del saldatore
