Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001104
No customer reviews for the moment.
16 other products in the same category
SONY PS4 CXD90026AG CXD90026G Stencil Template
Brands: Chipsetpro.com
€5.40
SONY PS4 CXD90026AG CXD90026G Stencil Template
E31505M SR2FN Stencil Template 90x90
Brands: Chipsetpro.com
€20.11
E3-1505M SR2FN Stencil Template 90*90
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
Brands: Chipsetpro.com
€9.82
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
IT8586VG IT8587VG IT8517VG IT8585VG IT8518VG IT8528VG Stencil Template
Brands: Chipsetpro.com
€7.46
IT8586VG IT8587VG IT8517VG IT8585VG IT8518VG IT8528VG Stencil Template
BD82Z68 SLJ4F Stencil Template
