E31535M SR2FM Stencil Template 90x90
E3-1535M SR2FM Stencil Template 90*90
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
E3-1535M SR2FM Stencil Template 90*90
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
BD82HM75 SLJ8F Stencil Template 90*90
i3-6100U SR2EU Stencil Template 90*90
i5-3210M SR0N0 Stencil Template 90*90