Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002967
No customer reviews for the moment.
16 other products in the same category
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
Brands: Chipsetpro.com
€9.82
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
i35010U SR23Z Stencil Template 90x90
Brands: Chipsetpro.com
€9.97
i3-5010U SR23Z Stencil Template 90*90
i75700HQ SR2BP Stencil Template 90x90
Brands: Chipsetpro.com
€17.81
i7-5700HQ SR2BP Stencil Template 90*90
i76820HQ SR2FU Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i7-6820HQ SR2FU Stencil Template 90*90
i7-4650U SR16H Stencil Template 90*90
