Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
i7-5700HQ SR2BP Stencil Template 90*90
SONY PS4 CXD90025G Stencil Template
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
215-0798006 Stencil Template 90*90
