SR2NH H67388 Stencil Solder Station Kits
SR2NH H67388 Stencil Solder Station Kits
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
SR2NH H67388 Stencil Solder Station Kits
i5-4210U SR1EF Stencil Template 90*90
GL82HM170 SR2C4 Stencil Template 90*90
i5-7442EQ SR34U Stencil Template 90*90
GTX1060 N17E-G1-A1 Stencil Template 90*90