Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004743
No customer reviews for the moment.
16 other products in the same category
F2117LP20H DF2117RVPLP20HV Stencil Template
Brands: Chipsetpro.com
€7.46
F2117LP-20H DF2117RVPLP20HV Stencil Template
SONY PS3 D5305AFK RSX D5305F Stencil Template
Brands: Chipsetpro.com
€5.40
SONY PS3 D5305AFK RSX D5305F Stencil Template
GTX970M N16EGTA1 Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
GTX970M N16E-GT-A1 Stencil Template 90*90
i76820HQ SR2FU Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i7-6820HQ SR2FU Stencil Template 90*90
BD82C602 SLJKG Stencil Template 90*90
