Please note: Due to too many models, the factory can only guarantee 90% model accuracy, about 10% error, please understand!
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000866
No customer reviews for the moment.
16 other products in the same category
Samsung Exynos9820SM8150S10S10NITE10 Stencil Template
Brands: Chipsetpro.com
€8.58
Samsung Exynos9820/SM8150/S10/S10+/NITE10 Stencil Template
AM7410JBY44JB Stencil Template 90x90
Brands: Chipsetpro.com
€9.97
AM7410JBY44JB Stencil Template 90*90
Universal 27pcs 90mm*90mm Stencil Template+BGA Solder Station
