Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
LVDS Cable for screen Asus X44 A44 p/n: 14005-00040100 14005-00150100 14G140344000 14G140344010
Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad 350*250mm
10# SATA Hard Disk Power Line Transfer Line 4 pin IDE to SATA serial Connection Line
HAYEAR 14MP HDMI Microscope Camera USB Industry Digital Eyepiece with 0.5xC-mount Lens
LVDS Cable for screen Acer 7551G 7751 7741 7741G LED P/N: 50.4HN01.001 50.4HN01.011 50.4HN01.012
GORDAK 863 Full BGA Rework Solder Hot Air Heat Gun iron IR Infrared Preheating Station
ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base
RU 78 Keys Wireless Keyboard Bluetooth Ultra Slim for iPad/Windows OS/Mac/Android
60W Soldering Iron with T-head + Blue Teflon Cable
Honton HT-R260 Heating table constant temperature welding stage
LVDS Cable for screen Lenovo S9 S10
LVDS Cable for screen HP 4530S 4535S 4430S P/N: 647002-001 6017B0269101
HC-06 Wireless Bluetooth Arduino PI JY-MCU Serial RF 5V Transeiver Module
VETUS ESD-13 Safe Anti-Static Stainless Steel Tweezers Maintenance Repair Tools
250K PMTC 0.55mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls
QUICK 861DW lead-Free hot 1000W 220V High-Power Hot air Disassembly Station
1.5m S-993A S-995A Pump Solder Sucker Gun Suction nozzle
