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RCHTEK RT8209B (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
3,45 €

RICHTEK RT8209B (ANG.)

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NFP100NA2 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
5,40 €

NF-SPP-100N-A2

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
3,45 €

ENE KB3926QF D2

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Oficjalna strona Bluetooth Stereo Headset

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000245
33,44 €

Oficjalna strona Bluetooth Stereo Headset

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i56300HQ templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
6,84 €

i5-6300HQ templariusz

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BROADCOM BCM5882B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
7,94 €

BROADCOM BCM5882B

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ZME350GBB22G templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
5,40 €

ZME350GBB22G templariusz

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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios wygrało 8 3264bitów i Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
22,01 €

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios wygrało 832/64bit i Adapter Socket

RCHTEK RT8209B (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
3,45 €

RICHTEK RT8209B (ANG.)

wishlist
Compare

NFP100NA2 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
5,40 €

NF-SPP-100N-A2

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
3,45 €

ENE KB3926QF D2

wishlist
Compare

Oficjalna strona Bluetooth Stereo Headset

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000245
33,44 €

Oficjalna strona Bluetooth Stereo Headset

wishlist
Compare

i56300HQ templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
6,84 €

i5-6300HQ templariusz

wishlist
Compare

BROADCOM BCM5882B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
7,94 €

BROADCOM BCM5882B

wishlist
Compare

ZME350GBB22G templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
5,40 €

ZME350GBB22G templariusz

wishlist
Compare

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios wygrało 8 3264bitów i Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
22,01 €

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios wygrało 832/64bit i Adapter Socket

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