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  • Marka: Chipsetpro.com
  • Marka: Winbond & Macronix
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TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
3,45 €

TPS2546

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GK10687575 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
6,47 €

GK106-875-A1 Stencil Template

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SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
180,51 €

SR2EU i3-6100U

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IRF6725

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
3,45 €

IRF6725MTRPBF

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Maksymalny system rekonwertacji komputera Apple o częstotliwości 45W 60W Magsafe 1

Description

NEW Cord for you repair the MagSafe Power Adapter.

Length: 5.5 Feet.

100% Brand New.

Attention

Magsafe 1 Compatible with the MacBook Air Pro Before 2012 year

Magsafe 2 Compatible with the MacBook Air Pro After 2012 year

Compatible for all 45W 85W 60W AC Power Adapter of Apple:

Apple 14.5V3.1A Rectangular-shaped 5-pin Magnet

Apple 14.5V3.1A Square-shaped 5-pin Magnet

Apple 16.5V3.65A Rectangular-shaped 5-pin Magnet

Apple 16.5V3.65A Square-shaped 5-pin Magnet

Apple 18.5V4.6A Rectangular-shaped 5-pin Magnet

Apple 18.5V4.6A Square-shaped 5-pin Magnet

CH000256
6,59 €

Maksymalny system rekonwertacji komputera Apple o częstotliwości 45W 60W Magsafe 1

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8203455A DC Power Jack Board for Apple MacBook Air 13 A1466 20132015 MD760 (ang.)

DC IN USB Jack Power Audio Board 820-3455 Apple MacBook Air 13" A1466 2013-2015

Compatiable:

MacBook Air Core i5 1.3 13" (2013)

MacBook Air Core i7 1.7 13" (2013)

MacBook Air Core i5 1.4 13" (2014)

MacBook Air Core i7 1.7 13" (2014)

Apple MacBook Air 13" A1466 2013 2014 MD760

Package:

1 x DC Power Jack Board for Apple MacBook Air 13" A1466 2013 2014 2015 MD760 820-3455-A

CH000259
60,79 €

820-3455-A DC Power Jack Board for Apple MacBook Air 13 A1466 2013-2015 (ang.)

TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
3,45 €

TPS2546

wishlist
Compare

GK10687575 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
6,47 €

GK106-875-A1 Stencil Template

wishlist
Compare

SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
180,51 €

SR2EU i3-6100U

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Compare

IRF6725

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
3,45 €

IRF6725MTRPBF

wishlist
Compare

Maksymalny system rekonwertacji komputera Apple o częstotliwości 45W 60W Magsafe 1

Description

NEW Cord for you repair the MagSafe Power Adapter.

Length: 5.5 Feet.

100% Brand New.

Attention

Magsafe 1 Compatible with the MacBook Air Pro Before 2012 year

Magsafe 2 Compatible with the MacBook Air Pro After 2012 year

Compatible for all 45W 85W 60W AC Power Adapter of Apple:

Apple 14.5V3.1A Rectangular-shaped 5-pin Magnet

Apple 14.5V3.1A Square-shaped 5-pin Magnet

Apple 16.5V3.65A Rectangular-shaped 5-pin Magnet

Apple 16.5V3.65A Square-shaped 5-pin Magnet

Apple 18.5V4.6A Rectangular-shaped 5-pin Magnet

Apple 18.5V4.6A Square-shaped 5-pin Magnet

CH000256
6,59 €

Maksymalny system rekonwertacji komputera Apple o częstotliwości 45W 60W Magsafe 1

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Bulb ELP21V13H010L21 for EMP53EMP73PowerLite 53c Projector (ang.)

Item Details

Product Name:Generic Bare Bulb without case

Part Number:ELPLP21/V13H010L21

Compatible Models: For EMP-53 / EMP-73 / PowerLite 53c / PowerLite 73c/EMP-73C/EMP-53C

Wattage:165 Watts

CH000257
36,05 €

Bułgab ELP21/V13H010L21 dla EMP-53/EMP-73/Power-73/Power-73/Powerb EMP-53/EMP-73 (ang.) Lite 53c Projector (ang.)

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8203455A DC Power Jack Board for Apple MacBook Air 13 A1466 20132015 MD760 (ang.)

DC IN USB Jack Power Audio Board 820-3455 Apple MacBook Air 13" A1466 2013-2015

Compatiable:

MacBook Air Core i5 1.3 13" (2013)

MacBook Air Core i7 1.7 13" (2013)

MacBook Air Core i5 1.4 13" (2014)

MacBook Air Core i7 1.7 13" (2014)

Apple MacBook Air 13" A1466 2013 2014 MD760

Package:

1 x DC Power Jack Board for Apple MacBook Air 13" A1466 2013 2014 2015 MD760 820-3455-A

CH000259
60,79 €

820-3455-A DC Power Jack Board for Apple MacBook Air 13 A1466 2013-2015 (ang.)

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