• Show Sidebar

Jest 5080 produktów.

Aktywne filtry

  • Marka: Chipsetpro.com
wishlist
Compare
Quickview

RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
3,45 €

RICHTEK RT8166BZQW

wishlist
Compare
Quickview

Strona oficjalna DC

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
3,61 €

DC Power Jack, Part #PJ089 (ang.)

wishlist
Compare
Quickview

Lenovo Idea Oficjalna strona Pad Flex 10 DC Power Jack Socket Connector (ang.)

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
4,97 €

Lenovo Idea Oficjalna strona Pad Flex 10 DC Power Jack Socket Connector (ang.)

wishlist
Compare
Quickview

TI BQ24753ATI (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
3,45 €

TI BQ24753ATI (ANG.)

wishlist
Compare
Quickview

GK106220 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
6,47 €

GK106-220

wishlist
Compare
Quickview

MAX1772EI (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
3,45 €

MAX1772EI (ang.)

wishlist
Compare
Quickview

Realizacja RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
3,97 €

Realizacja RTM862-485

RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
3,45 €

RICHTEK RT8166BZQW

wishlist
Compare

Strona oficjalna DC

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
3,61 €

DC Power Jack, Part #PJ089 (ang.)

wishlist
Compare

Lenovo Idea Oficjalna strona Pad Flex 10 DC Power Jack Socket Connector (ang.)

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
4,97 €

Lenovo Idea Oficjalna strona Pad Flex 10 DC Power Jack Socket Connector (ang.)

wishlist
Compare

TI BQ24753ATI (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
3,45 €

TI BQ24753ATI (ANG.)

wishlist
Compare

GK106220 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
6,47 €

GK106-220

wishlist
Compare

MAX1772EI (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
3,45 €

MAX1772EI (ang.)

wishlist
Compare

Realizacja RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
3,97 €

Realizacja RTM862-485

wishlist
Compare
Back to top