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RICHTEK RT8152A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
3,45 €

RICHTEK RT8152A (ANG.)

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ZOTEK ZT98 Pocket Mini Portable

Features

Auto ranges

550V protection in resistance and capacitance ranges Large LCD display,MAX display 2000 counts

Sample rate: 3 times per second

Second Backlight

Data hold

Polarity identification Low voltage indication

low current measurement Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance, Diode and Continuity Testing

*AC volts: 0.1mV to 750V

*DC volts:0.1mV to 1000V

*AC current:0.1uA to 200mA

*DC current:0.1uA to 200mA

*Resistance :0.1O to 20MO

Specifications

(1)DC volts:200mV/2V/20V(0.8%+5),200V/800V(1.0%+8)

(2)AC volts: 200mV(1.5%+8),2V/20V/200V(1.2%+5),600V(1.5%+5)

(3)DC current:20mA(1.5%+5),200mA(1.2%+5)

(4)AC current:20mA(2.0%+5),200mA(1.5%+5)

(5)Resistance :200O(2.5%+5),2K/20K/200K/2M(1.0%+5),20MO(2.5%+5)

(6)Over range indication: OL

(7)Working environment: 0~40?, relative humidity < 80%

(8)Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(9)Dimension: 130*65*30mm

(10)Weight: 130g

Package Included

Accessories: Users manual,a pair of test leads

CH000376
14,55 €

ZOTEK ZT98 Pocket Mini Portable

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N11MOP2

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
16,66 €

N11M-OP2S-A3 G210M

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TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
3,45 €

TPS51125A

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FH82B360

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
63,27 €

FH82B360

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SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
57,44 €

SR3S1 N4000

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NEC 22502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
3,45 €

NEC 22502

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338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
7,94 €

338S1077

RICHTEK RT8152A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
3,45 €

RICHTEK RT8152A (ANG.)

wishlist
Compare

ZOTEK ZT98 Pocket Mini Portable

Features

Auto ranges

550V protection in resistance and capacitance ranges Large LCD display,MAX display 2000 counts

Sample rate: 3 times per second

Second Backlight

Data hold

Polarity identification Low voltage indication

low current measurement Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance, Diode and Continuity Testing

*AC volts: 0.1mV to 750V

*DC volts:0.1mV to 1000V

*AC current:0.1uA to 200mA

*DC current:0.1uA to 200mA

*Resistance :0.1O to 20MO

Specifications

(1)DC volts:200mV/2V/20V(0.8%+5),200V/800V(1.0%+8)

(2)AC volts: 200mV(1.5%+8),2V/20V/200V(1.2%+5),600V(1.5%+5)

(3)DC current:20mA(1.5%+5),200mA(1.2%+5)

(4)AC current:20mA(2.0%+5),200mA(1.5%+5)

(5)Resistance :200O(2.5%+5),2K/20K/200K/2M(1.0%+5),20MO(2.5%+5)

(6)Over range indication: OL

(7)Working environment: 0~40?, relative humidity < 80%

(8)Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(9)Dimension: 130*65*30mm

(10)Weight: 130g

Package Included

Accessories: Users manual,a pair of test leads

CH000376
14,55 €

ZOTEK ZT98 Pocket Mini Portable

wishlist
Compare

N11MOP2

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
16,66 €

N11M-OP2S-A3 G210M

wishlist
Compare

TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
3,45 €

TPS51125A

wishlist
Compare

FH82B360

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
63,27 €

FH82B360

wishlist
Compare

SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
57,44 €

SR3S1 N4000

wishlist
Compare

NEC 22502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
3,45 €

NEC 22502

wishlist
Compare

338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
7,94 €

338S1077

wishlist
Compare
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