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PS8407ATQFN40GTR2A1 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
3,45 €

PS8407ATQFN40GTR2-A1 (ANG.)

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ITE IT8517VG HX0 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
3,45 €

ITE IT8517VG HX0 (ANG.)

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RICHTEK RT8152A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
3,45 €

RICHTEK RT8152A (ANG.)

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ZOTEK ZT98 Pocket Mini Portable

Features

Auto ranges

550V protection in resistance and capacitance ranges Large LCD display,MAX display 2000 counts

Sample rate: 3 times per second

Second Backlight

Data hold

Polarity identification Low voltage indication

low current measurement Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance, Diode and Continuity Testing

*AC volts: 0.1mV to 750V

*DC volts:0.1mV to 1000V

*AC current:0.1uA to 200mA

*DC current:0.1uA to 200mA

*Resistance :0.1O to 20MO

Specifications

(1)DC volts:200mV/2V/20V(0.8%+5),200V/800V(1.0%+8)

(2)AC volts: 200mV(1.5%+8),2V/20V/200V(1.2%+5),600V(1.5%+5)

(3)DC current:20mA(1.5%+5),200mA(1.2%+5)

(4)AC current:20mA(2.0%+5),200mA(1.5%+5)

(5)Resistance :200O(2.5%+5),2K/20K/200K/2M(1.0%+5),20MO(2.5%+5)

(6)Over range indication: OL

(7)Working environment: 0~40?, relative humidity < 80%

(8)Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(9)Dimension: 130*65*30mm

(10)Weight: 130g

Package Included

Accessories: Users manual,a pair of test leads

CH000376
14,55 €

ZOTEK ZT98 Pocket Mini Portable

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N11MOP2

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
16,66 €

N11M-OP2S-A3 G210M

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TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
3,45 €

TPS51125A

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FH82B360

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
63,27 €

FH82B360

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SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
57,44 €

SR3S1 N4000

PS8407ATQFN40GTR2A1 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
3,45 €

PS8407ATQFN40GTR2-A1 (ANG.)

wishlist
Compare

ITE IT8517VG HX0 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
3,45 €

ITE IT8517VG HX0 (ANG.)

wishlist
Compare

RICHTEK RT8152A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
3,45 €

RICHTEK RT8152A (ANG.)

wishlist
Compare

ZOTEK ZT98 Pocket Mini Portable

Features

Auto ranges

550V protection in resistance and capacitance ranges Large LCD display,MAX display 2000 counts

Sample rate: 3 times per second

Second Backlight

Data hold

Polarity identification Low voltage indication

low current measurement Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance, Diode and Continuity Testing

*AC volts: 0.1mV to 750V

*DC volts:0.1mV to 1000V

*AC current:0.1uA to 200mA

*DC current:0.1uA to 200mA

*Resistance :0.1O to 20MO

Specifications

(1)DC volts:200mV/2V/20V(0.8%+5),200V/800V(1.0%+8)

(2)AC volts: 200mV(1.5%+8),2V/20V/200V(1.2%+5),600V(1.5%+5)

(3)DC current:20mA(1.5%+5),200mA(1.2%+5)

(4)AC current:20mA(2.0%+5),200mA(1.5%+5)

(5)Resistance :200O(2.5%+5),2K/20K/200K/2M(1.0%+5),20MO(2.5%+5)

(6)Over range indication: OL

(7)Working environment: 0~40?, relative humidity < 80%

(8)Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(9)Dimension: 130*65*30mm

(10)Weight: 130g

Package Included

Accessories: Users manual,a pair of test leads

CH000376
14,55 €

ZOTEK ZT98 Pocket Mini Portable

wishlist
Compare

N11MOP2

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
16,66 €

N11M-OP2S-A3 G210M

wishlist
Compare

TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
3,45 €

TPS51125A

wishlist
Compare

FH82B360

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
63,27 €

FH82B360

wishlist
Compare

SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
57,44 €

SR3S1 N4000

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Compare
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