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  • Marka: Winbond & Macronix
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MASTECH MS8239C Digital Multimetry

Features:

Pocket Size

Tests Voltage, Current, Resistance, Capacitance, Frequency and Duty Cycle

Diode Check and Continuity Test

Type K thermocouple contact temperature measurement

Data Hold and Display Back Light

MAX LCD Display: 4000Counts

Auto Power Off

Specification:

DC voltage: 400mV/4V/40V/400V/600V (0.5% +3)

AC voltage: 4V/40V/400V/600V (1.2% +5)

DC current: 400uA/4000uA/40mA/400mA (1.0% +5), 10A (2.0% +10)

AC current: 400uA/4000uA/40mA/400mA (1.2% +5), 10A (2.5% +10)

Resistance: 200O/2KO/20KO/200KO/2MO (0.8% +5)

Frequency: 0HZ ~ 9.999MHz (1.5% +5)

Capacitance: 5nF/50nF/500nF/5uF/50uF/100uF (3.0% +5)

Duty cycle: 1% ~ 99.9% (3.0% +5)

Temperature ( C) -20 C ~ 1000 C (3.0% +3)

Temperature ( F) -4 F ~ 1832 F (3.0% +3)

General Characteristics:

Dimension: 150mm * 74mm * 41mm

Product Weight: 202g

Power Supply: 2 * 1.5V AAA (not included)

Package Size: 16 * 11 * 5cm / 6.2 * 4.4 * 2in

Package Weight: 330g / 11.7oz

Package List:H13110 *1 / MS8239C

1 * Palm Size MASTECH MS8239C Auto Ranging Digital Multimeter

1 * Type K Thermocouple

1 * Pair Test Lead

1 * English Manual

CH000411
30,96 €

MASTECH MS8239C Digital Multimetry W: Capacithood Temperature Testy

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RT9921GQV Richets A9F X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
3,45 €

RT9921GQV Richtek A9 (ang.)

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2160811030 templi Stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
9,97 €

216-0811030 Template 9090 (ang.)

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MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
3,45 €

MAX3243

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STLINK V2 JTAG USB Programming STM8

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
14,30 €

St-LINK V2 JTAG USB Programming STM8/STM32 Debuger (ang.)

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M5Y71 SR23Q templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
7,46 €

M-5Y71 SR23Q templariusz

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H99261 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
14,92 €

H99261 stencil

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RCHTEK RT9202 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
3,45 €

RCHTEK RT9202 (ANG.)

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MCP79MXB3 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
5,40 €

MCP79MXT-B3 Stencil Template

MASTECH MS8239C Digital Multimetry

Features:

Pocket Size

Tests Voltage, Current, Resistance, Capacitance, Frequency and Duty Cycle

Diode Check and Continuity Test

Type K thermocouple contact temperature measurement

Data Hold and Display Back Light

MAX LCD Display: 4000Counts

Auto Power Off

Specification:

DC voltage: 400mV/4V/40V/400V/600V (0.5% +3)

AC voltage: 4V/40V/400V/600V (1.2% +5)

DC current: 400uA/4000uA/40mA/400mA (1.0% +5), 10A (2.0% +10)

AC current: 400uA/4000uA/40mA/400mA (1.2% +5), 10A (2.5% +10)

Resistance: 200O/2KO/20KO/200KO/2MO (0.8% +5)

Frequency: 0HZ ~ 9.999MHz (1.5% +5)

Capacitance: 5nF/50nF/500nF/5uF/50uF/100uF (3.0% +5)

Duty cycle: 1% ~ 99.9% (3.0% +5)

Temperature ( C) -20 C ~ 1000 C (3.0% +3)

Temperature ( F) -4 F ~ 1832 F (3.0% +3)

General Characteristics:

Dimension: 150mm * 74mm * 41mm

Product Weight: 202g

Power Supply: 2 * 1.5V AAA (not included)

Package Size: 16 * 11 * 5cm / 6.2 * 4.4 * 2in

Package Weight: 330g / 11.7oz

Package List:H13110 *1 / MS8239C

1 * Palm Size MASTECH MS8239C Auto Ranging Digital Multimeter

1 * Type K Thermocouple

1 * Pair Test Lead

1 * English Manual

CH000411
30,96 €

MASTECH MS8239C Digital Multimetry W: Capacithood Temperature Testy

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RT9921GQV Richets A9F X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
3,45 €

RT9921GQV Richtek A9 (ang.)

wishlist
Compare

2160811030 templi Stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
9,97 €

216-0811030 Template 9090 (ang.)

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FULL SET OF CPU SOCKET TESTER FOR (ANG.)

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

The two generation, the three generation, the five generation, AMD638, 989, MIN, DDR3, DDR4

Login to Download: * User Manual Download

CH000414
69,00 €

FULL SET OF CPU SOCKET TESTER FOR (ANG.)

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MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
3,45 €

MAX3243

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Compare

STLINK V2 JTAG USB Programming STM8

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
14,30 €

St-LINK V2 JTAG USB Programming STM8/STM32 Debuger (ang.)

wishlist
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M5Y71 SR23Q templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
7,46 €

M-5Y71 SR23Q templariusz

wishlist
Compare

H99261 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
14,92 €

H99261 stencil

wishlist
Compare

RCHTEK RT9202 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
3,45 €

RCHTEK RT9202 (ANG.)

wishlist
Compare

MCP79MXB3 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
5,40 €

MCP79MXT-B3 Stencil Template

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