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ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
3,45 €

ISL95835HRZ

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2160674026

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
39,27 €

216-0674026

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i7620M Q4P

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
5,40 €

i7-620M Q4CB

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Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
3,45 €

Winbond W25Q32FW

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SRG0N SRGK SRFD0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000427
18,40 €

SRG0N SRGK SRFD0

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2160 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000428
5,40 €

216-081 000 templariusz

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TOP3100 – programista ECU Chip Tunning Programmer Eprom

TOP3100 USB Universal Programmer ECU Chip Tunning Programmer TOP 3100 Eprom IC Programmer

Login to Download: Download software

Description:

The TOP3100 programmer has compact size, lowe power comsuption, high reliability. This is an universal equipment especially designed for MCU and EPROMs programming.

Top 3 Reasons To Get TOP3100:

? 1.Support System: Windows7/Vista/Xp 32bits

? 2.USB universal serial port is used to connect with the PC, communications, support 2000/xp/Vista/Win7, software upgrades and flexible.

? 3.Language: English

Features:

? 1.Full driving with 48 pin(Vpp/Vcc/GND/TTL), good for furture upgrading.

? 2.Support 2.5V to 6.5V device.

? 3.Selectable to use USB or extral 5V power supplier to supply power.

? 4.Transmission speed is 12MHz/s.

? 5.Suitable to work with Desktop and Laptop.

? 6.With current protection fuction, effectively protects the programmer and devices.

? 7.Automatic Pin status detection.

? 8.48 pins self-lock sockets.

? 9.Support operation system: WINDOWS7/vista/2000/2003/XP;

? 10.Plastic cabinet, small size and light weight.

? 11.Auto detect company and type of the IC.

? 12.Software support: TopWin ver6.0 or newer.

Specifications:

? 1.Software: Topwin6 (for Windows7/Vista/2003/2000//xp)

? 2.Actual tested Speed(PIII/800M, Windows98se, USB1.1):

28F320 write and check 104 seconds,

29LF320 write and check 112 seconds,

p89c58 write and check 5 seconds,

? 3.Size: 155mm*110mm*26mm

? 4.Weight for the programmer only: 275g

? 5.Power: < 2.5W (5V/500mA)

? 6.48 Pin self-lock socket (Changeable)

Package List:

1pc x Top3100 programmer;

1pc x CD

1pc x USB cable

1pc x Adapter

1pc x User manual

CH000429
133,02 €

TOP3100 – programista ECU Chip Tunning Programmer Eprom

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Apple BIOS MBA 13 2013 A1466 8203437 EMC2632

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000430
30,71 €

Apple BIOS MBA 13 2013 A1466 820-3437 EMC2632 (ang.)

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G96632C1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000432
5,40 €

G96-632C1 templariusz

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i72617M SR03T templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
5,40 €

I7-2617M templariusz

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GP107300A1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000434
5,40 €

GP107-300-A1 Stencil Template (ang.)

ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
3,45 €

ISL95835HRZ

wishlist
Compare

2160674026

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
39,27 €

216-0674026

wishlist
Compare

i7620M Q4P

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
5,40 €

i7-620M Q4CB

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Compare

Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
3,45 €

Winbond W25Q32FW

wishlist
Compare

SRG0N SRGK SRFD0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000427
18,40 €

SRG0N SRGK SRFD0

wishlist
Compare

2160 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000428
5,40 €

216-081 000 templariusz

wishlist
Compare

TOP3100 – programista ECU Chip Tunning Programmer Eprom

TOP3100 USB Universal Programmer ECU Chip Tunning Programmer TOP 3100 Eprom IC Programmer

Login to Download: Download software

Description:

The TOP3100 programmer has compact size, lowe power comsuption, high reliability. This is an universal equipment especially designed for MCU and EPROMs programming.

Top 3 Reasons To Get TOP3100:

? 1.Support System: Windows7/Vista/Xp 32bits

? 2.USB universal serial port is used to connect with the PC, communications, support 2000/xp/Vista/Win7, software upgrades and flexible.

? 3.Language: English

Features:

? 1.Full driving with 48 pin(Vpp/Vcc/GND/TTL), good for furture upgrading.

? 2.Support 2.5V to 6.5V device.

? 3.Selectable to use USB or extral 5V power supplier to supply power.

? 4.Transmission speed is 12MHz/s.

? 5.Suitable to work with Desktop and Laptop.

? 6.With current protection fuction, effectively protects the programmer and devices.

? 7.Automatic Pin status detection.

? 8.48 pins self-lock sockets.

? 9.Support operation system: WINDOWS7/vista/2000/2003/XP;

? 10.Plastic cabinet, small size and light weight.

? 11.Auto detect company and type of the IC.

? 12.Software support: TopWin ver6.0 or newer.

Specifications:

? 1.Software: Topwin6 (for Windows7/Vista/2003/2000//xp)

? 2.Actual tested Speed(PIII/800M, Windows98se, USB1.1):

28F320 write and check 104 seconds,

29LF320 write and check 112 seconds,

p89c58 write and check 5 seconds,

? 3.Size: 155mm*110mm*26mm

? 4.Weight for the programmer only: 275g

? 5.Power: < 2.5W (5V/500mA)

? 6.48 Pin self-lock socket (Changeable)

Package List:

1pc x Top3100 programmer;

1pc x CD

1pc x USB cable

1pc x Adapter

1pc x User manual

CH000429
133,02 €

TOP3100 – programista ECU Chip Tunning Programmer Eprom

wishlist
Compare

Apple BIOS MBA 13 2013 A1466 8203437 EMC2632

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000430
30,71 €

Apple BIOS MBA 13 2013 A1466 820-3437 EMC2632 (ang.)

wishlist
Compare

G96632C1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000432
5,40 €

G96-632C1 templariusz

wishlist
Compare

i72617M SR03T templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
5,40 €

I7-2617M templariusz

wishlist
Compare

GP107300A1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000434
5,40 €

GP107-300-A1 Stencil Template (ang.)

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Compare
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