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  • Marka: Winbond & Macronix
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G98645U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000436
5,40 €

G98-645 templariusz

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2160772034

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
9,97 €

216-0772034 stencil

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Infineon SLB 9635TT 12 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
3,97 €

Infineon SLB 9635 TT 1.2 (ang.)

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i72677M SR0D2 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
5,40 €

I7-2677M SR0D2 Stencil Template (ang.)

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SMSC LPC47N250MD (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
3,45 €

SMSC LPC47N250-MD (ANG.)

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RENESAS RJK03E1D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
3,45 €

RENESAS RJK03E1D

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OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
3,45 €

OZ129TN

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stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
5,72 €

stencil

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Iprog Programmer V85 Wsparcie pełnej wersji z Probes Adapter

Iprog+ Programmer V85 Support Full Version with Probes Adapters

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter

1pc x K-line Adapter

1pc x Welding Line

1set x Probes Adapters for in-circuit ECU

1pc x IPROG Plus PCF79xx SD-Card Adapter

1pc x Universal RDIF Adapter

CH000446
174,05 €

Iprog+ Programmer V85 Support Full Version with Probes Adapter (ang.)

G98645U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000436
5,40 €

G98-645 templariusz

wishlist
Compare

2160772034

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
9,97 €

216-0772034 stencil

wishlist
Compare

Infineon SLB 9635TT 12 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
3,97 €

Infineon SLB 9635 TT 1.2 (ang.)

wishlist
Compare

i72677M SR0D2 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
5,40 €

I7-2677M SR0D2 Stencil Template (ang.)

wishlist
Compare

SMSC LPC47N250MD (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
3,45 €

SMSC LPC47N250-MD (ANG.)

wishlist
Compare

RENESAS RJK03E1D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
3,45 €

RENESAS RJK03E1D

wishlist
Compare

OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
3,45 €

OZ129TN

wishlist
Compare

stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
5,72 €

stencil

wishlist
Compare

Iprog Programmer V85 Wsparcie pełnej wersji z Probes Adapter

Iprog+ Programmer V85 Support Full Version with Probes Adapters

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter

1pc x K-line Adapter

1pc x Welding Line

1set x Probes Adapters for in-circuit ECU

1pc x IPROG Plus PCF79xx SD-Card Adapter

1pc x Universal RDIF Adapter

CH000446
174,05 €

Iprog+ Programmer V85 Support Full Version with Probes Adapter (ang.)

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Compare
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