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14in1 Open Pry Screwdriver Repair Tool Kit

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
8,58 €

14in1 Open Pry Screwdriver Repair Tool Kit

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i55200U (ang.) stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
9,96 €

I5-5200U stencil

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i73667U SR0N5 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
5,40 €

SR0N5 Stencil Template (ang.)

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N15SG

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
27,57 €

N15S-GT-B-A2

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i57200U SR342 Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004962
9,96 €

I5-7200U SR342 Stencil Template 90*90 (ang.)

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LGE3530

LGE35230

Part Number LGE35230 Manufacturer LG

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004965
23,83 €

LGE3530

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DMD 12806038B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004966
158,85 €

DMD 1280-6038B

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QUALCOMM (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004968
3,45 €

QUALCOMM (ANG.)

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PMB8763 A V100 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004969
3,49 €

PMB8763 (ANG.)

14in1 Open Pry Screwdriver Repair Tool Kit

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
8,58 €

14in1 Open Pry Screwdriver Repair Tool Kit

wishlist
Compare

i55200U (ang.) stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
9,96 €

I5-5200U stencil

wishlist
Compare

i73667U SR0N5 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
5,40 €

SR0N5 Stencil Template (ang.)

wishlist
Compare

N15SG

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
27,57 €

N15S-GT-B-A2

wishlist
Compare

i57200U SR342 Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004962
9,96 €

I5-7200U SR342 Stencil Template 90*90 (ang.)

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30 mm FOIL TAPE Electronic Tool (ang.)

30mm*30m Single Conductive COPPER FOIL TAPE Electronic Tool

Part Number Copper Foil Tape Material CU 99.98%

Side One Sided Conductive Heat Resistance -10 ?~120 ?

Adhesion Single sided adhesive Size 30mm*30m

CH004963
10,75 €

30 mm FOIL TAPE Electronic Tool (ang.)

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LGE3530

LGE35230

Part Number LGE35230 Manufacturer LG

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004965
23,83 €

LGE3530

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Compare

DMD 12806038B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004966
158,85 €

DMD 1280-6038B

wishlist
Compare

QUALCOMM (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004968
3,45 €

QUALCOMM (ANG.)

wishlist
Compare

PMB8763 A V100 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004969
3,49 €

PMB8763 (ANG.)

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Compare
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