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  • Dostępność: W magazynie
  • Marka: Andk Kzt Hmilu
  • Marka: Chipsetpro.com
  • Marka: Svod-project
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5931577 Okładka

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1425 2012 2013

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

Compatible Subfamily

A1425

MacBook Pro "Core i5" 2.5 13" Retina

MacBook Pro "Core i7" 2.9 13" Retina

MacBook Pro "Core i5" 2.6 13" Retina 2013

MacBook Pro "Core i7" 3.0 13" Retina 2013

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH005195
48,49 €

593-1577-B Trackpad Touchpad (ang.)

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ITE IT8510 GXA (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005196
3,45 €

ITE IT8510 (ANG.)

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MCP7APB1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005197
5,40 €

MCP7A

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Asus G71 G72 F90x90 X71 X73 X90 (ang.)

Cooler Fan for Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

Part Number Asus G71 G72 Manufacturer China

Voltage 5V Type CPU Fan

Power Connection 4-Pin Brand Unbranded/Generic

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005198
9,32 €

Asus G71 G72 F70 N70 M70 N90 X71 X73 X90 (ang.)

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Real ALC271X 6x6 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005199
3,45 €

Realtek ALC271X (6x6) (ang.)

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15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008

Geniune/ Original Apple MacBook Pro A1286 15 LCD LVDS Screen Ribbon Flex Cable 2008, 2009, 2010 & 2011 only!

Removed from new MacBook, some signs of removal possible but they are in good condition

Compatible Order Numbers:

MC371LL/A

MC372LL/A

MC373LL/A

MC721LL/A

MC723LL/A

MD104LL/A

MD035LL/A

MB470LL/A

MB471LL/A

MC026LL/A

MD318LL/A

MD322LL/A

MC118LL/A

MB985LL/A

MB986LL/A

CH005201
13,22 €

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008

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GD900 Silver Heat Sink Compound (ang.)

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
6,09 €

GD900 Silver Heat Sink Compound (ang.)

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SR2ZV i77500U

SR2ZV i7-7500U

Part Number SR2ZV i7-7500U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005205
275,69 €

SR2ZV i7-7500U

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BD82QS57 SLGZV templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005206
5,72 €

BD82QS57 SLGZV templariusz

5931577 Okładka

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1425 2012 2013

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

Compatible Subfamily

A1425

MacBook Pro "Core i5" 2.5 13" Retina

MacBook Pro "Core i7" 2.9 13" Retina

MacBook Pro "Core i5" 2.6 13" Retina 2013

MacBook Pro "Core i7" 3.0 13" Retina 2013

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH005195
48,49 €

593-1577-B Trackpad Touchpad (ang.)

wishlist
Compare

ITE IT8510 GXA (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005196
3,45 €

ITE IT8510 (ANG.)

wishlist
Compare

MCP7APB1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005197
5,40 €

MCP7A

wishlist
Compare

Asus G71 G72 F90x90 X71 X73 X90 (ang.)

Cooler Fan for Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

Part Number Asus G71 G72 Manufacturer China

Voltage 5V Type CPU Fan

Power Connection 4-Pin Brand Unbranded/Generic

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005198
9,32 €

Asus G71 G72 F70 N70 M70 N90 X71 X73 X90 (ang.)

wishlist
Compare

Real ALC271X 6x6 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005199
3,45 €

Realtek ALC271X (6x6) (ang.)

wishlist
Compare

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008

Geniune/ Original Apple MacBook Pro A1286 15 LCD LVDS Screen Ribbon Flex Cable 2008, 2009, 2010 & 2011 only!

Removed from new MacBook, some signs of removal possible but they are in good condition

Compatible Order Numbers:

MC371LL/A

MC372LL/A

MC373LL/A

MC721LL/A

MC723LL/A

MD104LL/A

MD035LL/A

MB470LL/A

MB471LL/A

MC026LL/A

MD318LL/A

MD322LL/A

MC118LL/A

MB985LL/A

MB986LL/A

CH005201
13,22 €

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008

wishlist
Compare

GD900 Silver Heat Sink Compound (ang.)

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
6,09 €

GD900 Silver Heat Sink Compound (ang.)

wishlist
Compare

SR2ZV i77500U

SR2ZV i7-7500U

Part Number SR2ZV i7-7500U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005205
275,69 €

SR2ZV i7-7500U

wishlist
Compare

BD82QS57 SLGZV templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005206
5,72 €

BD82QS57 SLGZV templariusz

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Compare
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