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RICHTEK RT8168BGQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005006
3,45 €

RICHTEK RT8168BGQW

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TPS51980A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005007
3,45 €

TPS51980A (ANG.)

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Diodes AP2191MPG13GP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005008
3,45 €

Diodes AP2191MPG-13 (ang.)

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EM2100ICJ23HM templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005009
5,40 €

EM2100ICJ23HM templariusz

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QFP64 CHIP PROGRAMMER SOCKET QFP6405REV2 (ang.)

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin spacing 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH005010
38,00 €

QFP64 – adapter gniazdowy do DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2

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Maxim MAX4211F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005012
6,35 €

Maxim MAX4211F

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IR3598MTRPBF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005014
3,45 €

IR3598MTRPBF

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CXD2991EG templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005015
5,40 €

CXD2991EG templariusz

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03 15mm15 mm Heatsink Thermal Pad Copper Shim dla procesora Laptop GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 0.3T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH005016
2,70 €

0,3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate (ang.)

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HW632 XHM603 Storage Lithium Battery (ang.)

Description:

HW-632 XH-M603 Charging Control Module 12-24V Storage Lithium Battery Charger Control Switch Protection Board

Product Introduction:

1.Model:XH-M603

2.Input Voltage:DC 10-30V

3.Display Precision:0.1V

4.Control Precision:0.1V

5.Output Type:direct output

6.Voltage Tolerance:+/-0.1V

7.Application Fields:12-24V storage battery

8.Size;82*58*18mm

Using Method:

1.Set Starting Voltage:in normal display voltage state,press the button will display start charging voltage;long press for 3s the digital tube will flash;you can start or stop button to set starting up charge voltage value

2.Set Stop Voltage:in normal display voltage state,press the button will display stoping charge voltage;long press the button for 3s the digital tube will flash;you can start or stop button to set stoping charge voltage value

3.Factory Reset:in power on state press the start/stop button at the same time,digital tube will display 888;that represents factory reset settings

Package Included:

1 DC12V-24V Lithium Battery Charge Control Protection Board /w LED Display XH-M603

CH005017
6,09 €

HW-632 XH-M603 Storage Lithium Battery (ang.)

RICHTEK RT8168BGQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005006
3,45 €

RICHTEK RT8168BGQW

wishlist
Compare

TPS51980A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005007
3,45 €

TPS51980A (ANG.)

wishlist
Compare

Diodes AP2191MPG13GP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005008
3,45 €

Diodes AP2191MPG-13 (ang.)

wishlist
Compare

EM2100ICJ23HM templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005009
5,40 €

EM2100ICJ23HM templariusz

wishlist
Compare

QFP64 CHIP PROGRAMMER SOCKET QFP6405REV2 (ang.)

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin spacing 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH005010
38,00 €

QFP64 – adapter gniazdowy do DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2

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Maxim MAX4211F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005012
6,35 €

Maxim MAX4211F

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New A1495 Battery For Apple Mac (ang.)

Description :

Battery type: Li-ion

Battery Model: A1495

Battery Voltage: 7.6V

Battery Capacity: 38.75Whr 5100mAh

Color: Black

Compatibility : For Apple Macbook

Part Number : 020-8084-A

CH005013
40,90 €

New A1495 Battery For Apple Mac (ang.)

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IR3598MTRPBF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005014
3,45 €

IR3598MTRPBF

wishlist
Compare

CXD2991EG templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005015
5,40 €

CXD2991EG templariusz

wishlist
Compare

03 15mm15 mm Heatsink Thermal Pad Copper Shim dla procesora Laptop GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 0.3T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH005016
2,70 €

0,3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate (ang.)

wishlist
Compare

HW632 XHM603 Storage Lithium Battery (ang.)

Description:

HW-632 XH-M603 Charging Control Module 12-24V Storage Lithium Battery Charger Control Switch Protection Board

Product Introduction:

1.Model:XH-M603

2.Input Voltage:DC 10-30V

3.Display Precision:0.1V

4.Control Precision:0.1V

5.Output Type:direct output

6.Voltage Tolerance:+/-0.1V

7.Application Fields:12-24V storage battery

8.Size;82*58*18mm

Using Method:

1.Set Starting Voltage:in normal display voltage state,press the button will display start charging voltage;long press for 3s the digital tube will flash;you can start or stop button to set starting up charge voltage value

2.Set Stop Voltage:in normal display voltage state,press the button will display stoping charge voltage;long press the button for 3s the digital tube will flash;you can start or stop button to set stoping charge voltage value

3.Factory Reset:in power on state press the start/stop button at the same time,digital tube will display 888;that represents factory reset settings

Package Included:

1 DC12V-24V Lithium Battery Charge Control Protection Board /w LED Display XH-M603

CH005017
6,09 €

HW-632 XH-M603 Storage Lithium Battery (ang.)

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Compare
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