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  • Dostępność: W magazynie
  • Marka: Andk Kzt Hmilu
  • Marka: Chipsetpro.com
  • Marka: Osram
  • Stan:: Nowy
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SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

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Realizacja RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Realizacja RTS5159

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LE82P31 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template (ang.)

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SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Oficjalna strona REV3

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i53210M SR0N0 Stencil Template 90x90x (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90 (ang.)

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216MEP6CLA14FG (ANG.)

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG (ANG.)

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2160769090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010

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LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112

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Flash Debug A2251 A2289 A2141 A2159 (ang.) Oficjalna strona Reading

In package included:

1) Programmer RT809 + usb cable
2) T2 Rom Socket 4x3 + Adesto Chip 1 pcs 
3) Zip clip 
4) 1.8V power converter
5) SOP8 - DIP8 adapter (~150 mm)
6) SOP8 - DIP8 adapter (~200-209 mm)

 

T2 Rom Socket Compatible:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958


If you used our EFI Ribbon Cables, also supported: 

MBA11 2015 A1465 820-00164
MBA11 2013 A1465 820-3435
MBA13 2011 A1369 820-3023
MBA11 2011 A1370 820-3024
MBA 13 2013 A1466 820-3437
MBA 13 2012 A1466 820-3209
MBA13 2015 A1466 820-00165
MBA13 2017 A1466 820-00165
MBP13 2016 A1708 820-00875
MBP13 2016 A1706 820-00239
MBP15 2017 A1707 820-00928
MBP15 2016 A1707 820-00281
MBP13 2017 A1706 820-00923
MBP13 2017 A1708 820-00840
MBP13 2015 A1502 820-4924
MBP13 2014 A1502 820-3476
MBP13 2014 A1502 820-3536 
MBP13 2013 A1502 820-3476
MBP13 2014 A1502 820-3476
MBP15 2012 A1398 820-3332
MBP15 2013 A1398 820-3332
MBP15 2013 A1398 820-3662
MBP15 2013 A1398 820-3787
MBP15 2014 A1398 820-3662
MBP15 2015 A1398 820-00138 
MBP15 2015 A1398 820-00163
MBP12 2015 A1534 820-00045
MBP12 2016 A1534 820-00244
Mini 2011 A1347 820-2993

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

 

SE000035
104,00 €

W skład pakietu wchodzi:

RT809 + usb cable
T2 Rom Socket 4x3 (ang.)
3) Zip clip
4) 1.8V power converter
5) SOP8 – adapter DIP8 (~150 mm)
6) SOP8 – adapter DIP8 (~200-209 mm)

W: Download RT809 (ang.) Oprogramowanie F

W: Download RT809F (ang.) ręcznik użytkownika

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

wishlist
Compare

Realizacja RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Realizacja RTS5159

wishlist
Compare

LE82P31 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template (ang.)

wishlist
Compare

SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Oficjalna strona REV3

wishlist
Compare

i53210M SR0N0 Stencil Template 90x90x (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90 (ang.)

wishlist
Compare

216MEP6CLA14FG (ANG.)

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG (ANG.)

wishlist
Compare

2160769090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010

wishlist
Compare

LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112

wishlist
Compare

Flash Debug A2251 A2289 A2141 A2159 (ang.) Oficjalna strona Reading

In package included:

1) Programmer RT809 + usb cable
2) T2 Rom Socket 4x3 + Adesto Chip 1 pcs 
3) Zip clip 
4) 1.8V power converter
5) SOP8 - DIP8 adapter (~150 mm)
6) SOP8 - DIP8 adapter (~200-209 mm)

 

T2 Rom Socket Compatible:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958


If you used our EFI Ribbon Cables, also supported: 

MBA11 2015 A1465 820-00164
MBA11 2013 A1465 820-3435
MBA13 2011 A1369 820-3023
MBA11 2011 A1370 820-3024
MBA 13 2013 A1466 820-3437
MBA 13 2012 A1466 820-3209
MBA13 2015 A1466 820-00165
MBA13 2017 A1466 820-00165
MBP13 2016 A1708 820-00875
MBP13 2016 A1706 820-00239
MBP15 2017 A1707 820-00928
MBP15 2016 A1707 820-00281
MBP13 2017 A1706 820-00923
MBP13 2017 A1708 820-00840
MBP13 2015 A1502 820-4924
MBP13 2014 A1502 820-3476
MBP13 2014 A1502 820-3536 
MBP13 2013 A1502 820-3476
MBP13 2014 A1502 820-3476
MBP15 2012 A1398 820-3332
MBP15 2013 A1398 820-3332
MBP15 2013 A1398 820-3662
MBP15 2013 A1398 820-3787
MBP15 2014 A1398 820-3662
MBP15 2015 A1398 820-00138 
MBP15 2015 A1398 820-00163
MBP12 2015 A1534 820-00045
MBP12 2016 A1534 820-00244
Mini 2011 A1347 820-2993

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

 

SE000035
104,00 €

W skład pakietu wchodzi:

RT809 + usb cable
T2 Rom Socket 4x3 (ang.)
3) Zip clip
4) 1.8V power converter
5) SOP8 – adapter DIP8 (~150 mm)
6) SOP8 – adapter DIP8 (~200-209 mm)

W: Download RT809 (ang.) Oprogramowanie F

W: Download RT809F (ang.) ręcznik użytkownika

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Compare
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