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SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

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Realizacja RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Realizacja RTS5159

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XELTEK SuperPro 610P – programista z zestawem adapterów 28 plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Technical Specifications

Input/Output built-in 48 pin connector

Package Types DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP

Interface USB 2.0

Software compatible OS Windows XP, Windows Vista, Windows 7, Windows 8 (32/64 bit)

Power Supply Input 90 V-250 V AC, output 12 V DC/1.5 A

Size, L W H 178 130 40 mm

Weight 0.38 kg (without package)

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
520,00 €

XELTEK SuperPro 610P Universal Programmer z zestawem adapterów 28 Adapter plus EID

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LE82P31 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template (ang.)

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SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Oficjalna strona REV3

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i53210M SR0N0 Stencil Template 90x90x (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90 (ang.)

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216MEP6CLA14FG (ANG.)

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG (ANG.)

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2160769090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010

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LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112

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T2ROM Chipa Adesto 3x4mm NOR Flash SPI 104MHz

In package:

Adesto T2 Rom Chip (BLANK, EMPTY, Memoria vacía, Leerer Speicher)  x 1 pcs

You can read backup, modify serial number, modify BIN file of T2 Rom Chip from 2018 to 2020 Year.

Compatible:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

Programmers who supported:  SVOD4, RT809F with adapter 1.8V, RT809H with adapter 1.8V, CH341A v1.7 which have integrated power manipulator 1.8V, 3.3V, 5V. 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000167
7,44 €

T2ROM Chipa Adesto 3x4mm NOR Flash SPI 104MHz

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A1990 EMC 3215 T2 (ANG.) Chip Blank 1.8volt 32Mbit NOR SPI Flash (ang.)

In package:

Adesto T2 Rom Chip (BLANK, EMPTY, Memoria vacía, Leerer Speicher)  x 1 pcs

T2 Rom Chip from 2018 to 2020 Year.

Compatible:

A1990 820-01041 EMC 3215

Programmers who supported:  SVOD4, RT809F with adapter 1.8V, RT809H with adapter 1.8V, CH341A v1.7 which have integrated power manipulator 1.8V, 3.3V, 5V. 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

CH000167
7,44 €

Blank T2 ROM Chipa Adesto 820-01041 EMC 3215

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil

wishlist
Compare

Realizacja RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Realizacja RTS5159

wishlist
Compare

XELTEK SuperPro 610P – programista z zestawem adapterów 28 plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Technical Specifications

Input/Output built-in 48 pin connector

Package Types DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP

Interface USB 2.0

Software compatible OS Windows XP, Windows Vista, Windows 7, Windows 8 (32/64 bit)

Power Supply Input 90 V-250 V AC, output 12 V DC/1.5 A

Size, L W H 178 130 40 mm

Weight 0.38 kg (without package)

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
520,00 €

XELTEK SuperPro 610P Universal Programmer z zestawem adapterów 28 Adapter plus EID

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Compare

LE82P31 Stencil Template (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template (ang.)

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Compare

SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Oficjalna strona REV3

wishlist
Compare

i53210M SR0N0 Stencil Template 90x90x (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90 (ang.)

wishlist
Compare

216MEP6CLA14FG (ANG.)

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG (ANG.)

wishlist
Compare

2160769090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010

wishlist
Compare

LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112

wishlist
Compare

T2ROM Chipa Adesto 3x4mm NOR Flash SPI 104MHz

In package:

Adesto T2 Rom Chip (BLANK, EMPTY, Memoria vacía, Leerer Speicher)  x 1 pcs

You can read backup, modify serial number, modify BIN file of T2 Rom Chip from 2018 to 2020 Year.

Compatible:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

Programmers who supported:  SVOD4, RT809F with adapter 1.8V, RT809H with adapter 1.8V, CH341A v1.7 which have integrated power manipulator 1.8V, 3.3V, 5V. 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000167
7,44 €

T2ROM Chipa Adesto 3x4mm NOR Flash SPI 104MHz

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Compare

A1990 EMC 3215 T2 (ANG.) Chip Blank 1.8volt 32Mbit NOR SPI Flash (ang.)

In package:

Adesto T2 Rom Chip (BLANK, EMPTY, Memoria vacía, Leerer Speicher)  x 1 pcs

T2 Rom Chip from 2018 to 2020 Year.

Compatible:

A1990 820-01041 EMC 3215

Programmers who supported:  SVOD4, RT809F with adapter 1.8V, RT809H with adapter 1.8V, CH341A v1.7 which have integrated power manipulator 1.8V, 3.3V, 5V. 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

CH000167
7,44 €

Blank T2 ROM Chipa Adesto 820-01041 EMC 3215

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Compare
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