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Display Cable 5931280A dla serii IMAC 215 21 2010 A1311

Product Name:

New lcd display cable 593-1280 593-1280A for IMAC 21.5 21 A1311 2010

Condition

New LCD Display Cable For Apple IMAC

Compatible Models:

Replace Part Number

593-1280, 593-1280A

Compatible Models

Compatible model: iMac 21.5 Mid 2010

Configuration: iMac Intel Core 21 3.0Ghz, 3.2Ghz

Model#: MC508LL/A, MC509LL/A A1311

CH000926
11,06 €

Display Cable 593-1280-A dla serii A1311 21 z 2010 roku

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LINEAR LT3470A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000927
3,97 €

LINEAR LT3470A (ANG.)

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ITE IT8587E FXA (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000929
3,45 €

ITE IT8587E FXA (ANG.)

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2160728020 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000930
5,40 €

216-07280202020 templariusz

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sR1Q0 Stencil Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000931
9,52 €

I5-4210H SR1Q0 Stencil Template 90*90 (ang.)

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NIKOS P2806UF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000932
3,45 €

NIKOS P2806U-F

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Maxim MAX1541ET

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000934
3,45 €

Maxim MAX1541ET

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800pc AntiStatic ESD Rubber Finger Cot Protector Cover (ang.)

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
7,34 €

800pc Anti-Static ESD Rubber Finger Cot Protector Cover (ang.)

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FIRCHILD FDMS3660S (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000936
3,45 €

FIRCHILD FDMS3660S (ANG.)

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NUVOTON NPCE985LA0DX (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000937
3,45 €

NUVOTON NPCE985LA0DX (ANG.)

Display Cable 5931280A dla serii IMAC 215 21 2010 A1311

Product Name:

New lcd display cable 593-1280 593-1280A for IMAC 21.5 21 A1311 2010

Condition

New LCD Display Cable For Apple IMAC

Compatible Models:

Replace Part Number

593-1280, 593-1280A

Compatible Models

Compatible model: iMac 21.5 Mid 2010

Configuration: iMac Intel Core 21 3.0Ghz, 3.2Ghz

Model#: MC508LL/A, MC509LL/A A1311

CH000926
11,06 €

Display Cable 593-1280-A dla serii A1311 21 z 2010 roku

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LINEAR LT3470A (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000927
3,97 €

LINEAR LT3470A (ANG.)

wishlist
Compare

ITE IT8587E FXA (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000929
3,45 €

ITE IT8587E FXA (ANG.)

wishlist
Compare

2160728020 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000930
5,40 €

216-07280202020 templariusz

wishlist
Compare

sR1Q0 Stencil Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000931
9,52 €

I5-4210H SR1Q0 Stencil Template 90*90 (ang.)

wishlist
Compare

NIKOS P2806UF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000932
3,45 €

NIKOS P2806U-F

wishlist
Compare

Maxim MAX1541ET

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000934
3,45 €

Maxim MAX1541ET

wishlist
Compare

800pc AntiStatic ESD Rubber Finger Cot Protector Cover (ang.)

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
7,34 €

800pc Anti-Static ESD Rubber Finger Cot Protector Cover (ang.)

wishlist
Compare

FIRCHILD FDMS3660S (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000936
3,45 €

FIRCHILD FDMS3660S (ANG.)

wishlist
Compare

NUVOTON NPCE985LA0DX (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000937
3,45 €

NUVOTON NPCE985LA0DX (ANG.)

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Compare
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