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2150848000 Stencil Template 90x9090x

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001010
9,97 €

215.08.000 stencil

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G96109C1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001012
5,40 €

G96-109-C1 templariusz

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BD82HM65 SLJ4P Stencil Template 90x90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001013
9,97 €

BD82HM65 SLJ4P Stencil Template 90*90 (ang.)

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KMFN0012MB214 Chip Nand Flash 8G

KMFNX0012M-B214 Chip Nand Flash 8Gb (FBGA221)

Part Number KMFNX0012M-B214 Manufacturer Samsung

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001014
28,59 €

KMFNX0012M-B214 Chip Nand Flash 8Gb (ang.)

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2150674034

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
39,18 €

215-0674034 RX781

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N11P templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001016
5,40 €

N11P-GE1-W-A3 Stencil Template

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47pc Reball Stencil Universal Directly Heated Template (ang.)

Please note: Due to too many models, the factory can only guarantee 95% model accuracy, about 5% error, please understand!

ATI 1100 / 1150 / RS485MC / 216TQA6AVA12FG 0.50

ATI 21515 / M64S / M72S / M82S / 216-0707011

ATI 216-0728018 / 0749001 / 0774009 0.50

ATI 215 0719090 / 8014 / 9042 0.50

ATI SB700 / RD780 / 2160674022 / 216-0674024 / 216-0674026 / 216-0752001 0.50

ATI RS800ME / RS600ME 0.50

Intel LE82GL960 / PM965 / GM965

Intel 945GM / 945PM / 82940GML / 943GML 0.50

Intel QG82 945GMS / 945GSE 0.50

Intel AC82PM45 / 82GM45 / 82GL40 / AC88CTPM 0.40

Intel NH82801GBM / GR / GB 0.60

Intel 82801HBM IBM 0.60

Intel BD82HM55 / BD82PM55 / BD82HM57

Intel AC82GS45 / AC82GS40 / LE82GS965

INTEL BD82HM65 / BD82HM67

NVidia NF G6150 / G6100 N A2 0.60

NVidia NF4 NA3 / NF4 A3 0.60

NVidia MCP67M / MCP6767MV / MCP77MV A2 0.50

GO7200 / 7300 / 7400N-A3 / 6200AGP / 630-A2 603 A2

NVIDIA NF 7100 / 6301 A2 0.50

nVidia G96 630 A1 / G96 600 A1

Nvidia G84 600 A2 / GO6200 / GO7600 / G86-730 / 750 / 770 0.60

Via VT8237A / 8235 0.60

Via C7M

Via VN896 / CN896 / P4M900 0.60

SIS M671 / M672 / 671DX 0.60

Universal 0.50

Universal 0.60

Universal 0.76

ATI 216 0697010 / 7020 / 0792006 0.50

SIS 756 0.60

MT5502ASNJ 0.50

ATI IXP460 0.50

QF9EES SR1W5 SR1SG 0.35mm

Intel i5-4200U i7-4500 SR1EB SR170 SR191 SR1EF SR16M

Nvidia GK107 N13P-GL-A1 N13M-GE1-B-A1

Intel i7-620M SLBTX i3-370M 0.4

Intel i5-2415M SR071 BGA1023 0.45

Nvidia N13M-GS-S-A2 N14M-GL-S-A2 0.50

Intel SR04S CPU i3-2310M BGA1023 SR109

Nvidia MCP79U-B2

Universal 0.30

ATI 215-0821056 0821060 0.50

Universal 0.40

ATI 218-0697010 0697020 0792006 0.50

Universal 0.45

Nvidia GK104-325-A2 0.50

CH001017
40,90 €

47pc Reball Stencil Universal Directly Heated Template (ang.)

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2160774007 HD5470 (ANG.)

216-0774007 HD5470

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001019
67,57 €

216-07707 HD5470

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JMC251LGAZ0A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001020
3,45 €

JMC251LGAZ0A (ANG.)

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BROADCOM BCM57785

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001021
3,45 €

BROADCOM BCM57785

2150848000 Stencil Template 90x9090x

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001010
9,97 €

215.08.000 stencil

wishlist
Compare

G96109C1 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001012
5,40 €

G96-109-C1 templariusz

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Compare

BD82HM65 SLJ4P Stencil Template 90x90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001013
9,97 €

BD82HM65 SLJ4P Stencil Template 90*90 (ang.)

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Compare

KMFN0012MB214 Chip Nand Flash 8G

KMFNX0012M-B214 Chip Nand Flash 8Gb (FBGA221)

Part Number KMFNX0012M-B214 Manufacturer Samsung

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001014
28,59 €

KMFNX0012M-B214 Chip Nand Flash 8Gb (ang.)

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Compare

2150674034

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
39,18 €

215-0674034 RX781

wishlist
Compare

N11P templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001016
5,40 €

N11P-GE1-W-A3 Stencil Template

wishlist
Compare

47pc Reball Stencil Universal Directly Heated Template (ang.)

Please note: Due to too many models, the factory can only guarantee 95% model accuracy, about 5% error, please understand!

ATI 1100 / 1150 / RS485MC / 216TQA6AVA12FG 0.50

ATI 21515 / M64S / M72S / M82S / 216-0707011

ATI 216-0728018 / 0749001 / 0774009 0.50

ATI 215 0719090 / 8014 / 9042 0.50

ATI SB700 / RD780 / 2160674022 / 216-0674024 / 216-0674026 / 216-0752001 0.50

ATI RS800ME / RS600ME 0.50

Intel LE82GL960 / PM965 / GM965

Intel 945GM / 945PM / 82940GML / 943GML 0.50

Intel QG82 945GMS / 945GSE 0.50

Intel AC82PM45 / 82GM45 / 82GL40 / AC88CTPM 0.40

Intel NH82801GBM / GR / GB 0.60

Intel 82801HBM IBM 0.60

Intel BD82HM55 / BD82PM55 / BD82HM57

Intel AC82GS45 / AC82GS40 / LE82GS965

INTEL BD82HM65 / BD82HM67

NVidia NF G6150 / G6100 N A2 0.60

NVidia NF4 NA3 / NF4 A3 0.60

NVidia MCP67M / MCP6767MV / MCP77MV A2 0.50

GO7200 / 7300 / 7400N-A3 / 6200AGP / 630-A2 603 A2

NVIDIA NF 7100 / 6301 A2 0.50

nVidia G96 630 A1 / G96 600 A1

Nvidia G84 600 A2 / GO6200 / GO7600 / G86-730 / 750 / 770 0.60

Via VT8237A / 8235 0.60

Via C7M

Via VN896 / CN896 / P4M900 0.60

SIS M671 / M672 / 671DX 0.60

Universal 0.50

Universal 0.60

Universal 0.76

ATI 216 0697010 / 7020 / 0792006 0.50

SIS 756 0.60

MT5502ASNJ 0.50

ATI IXP460 0.50

QF9EES SR1W5 SR1SG 0.35mm

Intel i5-4200U i7-4500 SR1EB SR170 SR191 SR1EF SR16M

Nvidia GK107 N13P-GL-A1 N13M-GE1-B-A1

Intel i7-620M SLBTX i3-370M 0.4

Intel i5-2415M SR071 BGA1023 0.45

Nvidia N13M-GS-S-A2 N14M-GL-S-A2 0.50

Intel SR04S CPU i3-2310M BGA1023 SR109

Nvidia MCP79U-B2

Universal 0.30

ATI 215-0821056 0821060 0.50

Universal 0.40

ATI 218-0697010 0697020 0792006 0.50

Universal 0.45

Nvidia GK104-325-A2 0.50

CH001017
40,90 €

47pc Reball Stencil Universal Directly Heated Template (ang.)

wishlist
Compare

2160774007 HD5470 (ANG.)

216-0774007 HD5470

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001019
67,57 €

216-07707 HD5470

wishlist
Compare

JMC251LGAZ0A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001020
3,45 €

JMC251LGAZ0A (ANG.)

wishlist
Compare

BROADCOM BCM57785

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001021
3,45 €

BROADCOM BCM57785

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