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G86303

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001034
5,40 €

G86-303 stencil

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N17EG1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
349,80 €

N17E-G1 GTX1060

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Realizacja RTD2132R

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001038
3,45 €

Realizacja RTD2132R

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ZOTEK ZT100 Multimeter Digital Multim Tester Back LightC Voltmeter (ang.)

Features

Auto ranges

550V protection in Resistance?Capacitance and Frequency ranges

Large LCD display,MAX display 4000 counts

Sample rate: 3 times per second

backlight

Data hold

Relative measurement

Polarity identification

Low voltage indication

10A high current and low current measurement

Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Frequency and duty cycle

* Frequency:1Hz to 10MHz

* Capacitance :10pF to 4000uF

* AC volts: 0.1mV to 750V

* DC volts:0.1mV to 1000V

* AC current:0.1uA to 10A

* DC current:0.1uA to 10A

* Resistance :0.1O to 40MO

* Duty cycle:1% to 99%

Specifications

(1)Capacitance :4nF(5.0%+4),40nF(2.5%+4),400nF/4.000uF/40.00uF/400.0uF/1000uF /4000uF(3.5%+4)

(2)DC volts:400mV/4V/40V(0.5%+4),400V/600V(0.8%+4)

(3)AC volts: 400mV(1.5%+4), 4V/40V/400V(1.2%+4),600V(1.5%+4)

(4)DC current:40mA/400mA(1.0%+4),10A(1.5%+4)

(5)AC current:40mA/400mA/10A(2.0%+4 ,50-200Hz)

(6)Resistance :400O/4K/40K/400K/4M(0.8%+4),40MO(2.0%+4)

(7)Frequency:99.5/999.5/9.999k/99.99k/999.9k/9.999MHz (0.08%+2)

(9)Duty cycle:0.1% to 99.9%(0.08%+2)

(10) Measurement mode: ?S mode

(11)Over range indication: OL

(12) Working environment: 0~40?, relative humidity < 80%

(13) Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(14) Dimension: 130*65*30mm

Package including

1 pc digital multimeter

CH001039
14,92 €

ZOTEK ZT100 Multimeter Digital Multim Tester Back Light AC/DC Voltmeter (ang.) Diode

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G86731 8400

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
54,97 €

G86-731

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Intersili ISL6259

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001044
3,45 €

Intersili ISL6259

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Compare
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EM1800GBB22GV templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001045
5,40 €

EM1800GBB22GV templariusz

G86303

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001034
5,40 €

G86-303 stencil

wishlist
Compare

N17EG1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
349,80 €

N17E-G1 GTX1060

wishlist
Compare

Realizacja RTD2132R

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001038
3,45 €

Realizacja RTD2132R

wishlist
Compare

ZOTEK ZT100 Multimeter Digital Multim Tester Back LightC Voltmeter (ang.)

Features

Auto ranges

550V protection in Resistance?Capacitance and Frequency ranges

Large LCD display,MAX display 4000 counts

Sample rate: 3 times per second

backlight

Data hold

Relative measurement

Polarity identification

Low voltage indication

10A high current and low current measurement

Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Frequency and duty cycle

* Frequency:1Hz to 10MHz

* Capacitance :10pF to 4000uF

* AC volts: 0.1mV to 750V

* DC volts:0.1mV to 1000V

* AC current:0.1uA to 10A

* DC current:0.1uA to 10A

* Resistance :0.1O to 40MO

* Duty cycle:1% to 99%

Specifications

(1)Capacitance :4nF(5.0%+4),40nF(2.5%+4),400nF/4.000uF/40.00uF/400.0uF/1000uF /4000uF(3.5%+4)

(2)DC volts:400mV/4V/40V(0.5%+4),400V/600V(0.8%+4)

(3)AC volts: 400mV(1.5%+4), 4V/40V/400V(1.2%+4),600V(1.5%+4)

(4)DC current:40mA/400mA(1.0%+4),10A(1.5%+4)

(5)AC current:40mA/400mA/10A(2.0%+4 ,50-200Hz)

(6)Resistance :400O/4K/40K/400K/4M(0.8%+4),40MO(2.0%+4)

(7)Frequency:99.5/999.5/9.999k/99.99k/999.9k/9.999MHz (0.08%+2)

(9)Duty cycle:0.1% to 99.9%(0.08%+2)

(10) Measurement mode: ?S mode

(11)Over range indication: OL

(12) Working environment: 0~40?, relative humidity < 80%

(13) Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(14) Dimension: 130*65*30mm

Package including

1 pc digital multimeter

CH001039
14,92 €

ZOTEK ZT100 Multimeter Digital Multim Tester Back Light AC/DC Voltmeter (ang.) Diode

wishlist
Compare

G86731 8400

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
54,97 €

G86-731

wishlist
Compare

Intersili ISL6259

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001044
3,45 €

Intersili ISL6259

wishlist
Compare

EM1800GBB22GV templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001045
5,40 €

EM1800GBB22GV templariusz

wishlist
Compare
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