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LE82GM965 SLA5T templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
5,40 €

LE82GM965 SLA5T templariusz

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i5520E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
5,40 €

I5-520E

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FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

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RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

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216LQA6AVA12FG templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
5,40 €

216LQA6AVA12FG templariusz

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

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UNIT UTD2102C (ANG.) Digital Storage Oscilloscope 100MHZ 1GGZ Sassa

UNI-T UTD2102CEX Oscilloscope Digital Storage 1G sample rate 100MHz bandwidth

Features:

1?Dual analog channels width range 1mV/div~20V/div;

2?7 inches widescreen LCD displays;

3?The new interface style;

4?Supports plug-and-play USB storage device. Communication with and remote control of computer through the USB device;

5?USB drive system software upgrade;

6?Storage of waveforms setups and interfaces waveforms and setups reproduction;

7?Automatic measurement of 32 waveform parameters;

8?Unique waveform recording and replay function;

9?Multilingual menu displays.

Product Specifications

Specification UTD2102CEX

Channels 2

Bandwidth 100MHz

Sample Rate 1Gs/s

Rise Time =3.5ns

Memory Depth 25kpts

Waveform Acquisition Rate =2000wfms/s

Vertical Sensitivity(V/div) 1mV/div~20V/div

Timebase Range(s/div) 2ns/div~50s/div

Storage Setup,Wave,Bitmap

Trigger Modes Edge, Pluse, Video,Slope,Alternate

Interface USB OTG

General Characteristic

Power 100-240VAC, 45-440Hz

Display 7 Inches 64K Color TFT LCD, 800480

Product Color White and Gray

Product Net Weight 2.2 Kg

Product Size (WHD) 306mm 147mm 122mm

Standard Accessories Probe2 (1,10 switchable), Power Cord , USB Cable, PC Software CD

Standard Individual Packing Gift Box, English Manual

Standard Quantity Per Carton 2 PCs

Standard Carton Measurement (LWH) 450mm 420mm 280mm

Standard Carton Cross Weight 8.5 Kg

Optional Accessories*

LA Module

Package List:

1 * UNI-T UTD 2102CEX Digital Storage Oscilloscope

2 * Probe (1,10 switchable)

1 * USB Cable

1 * Power Power Cable

1 * English Manual

1 * CD Software

CH000194
284,69 €

UTD2102CEX Digital Storage Oscilloscope 100MHZ 1GGZ Sa/USB wiele języków

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i72675QM templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
5,40 €

I7-2675QM templariusz

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INTELLE82GME965 SLA9F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
22,24 €

INTELLE82GME965 SLA9F (ANG.)

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GK107250 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
5,40 €

GK107-250-A2

LE82GM965 SLA5T templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
5,40 €

LE82GM965 SLA5T templariusz

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i5520E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
5,40 €

I5-520E

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FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

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Compare

RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

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Compare

216LQA6AVA12FG templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
5,40 €

216LQA6AVA12FG templariusz

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Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

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UNIT UTD2102C (ANG.) Digital Storage Oscilloscope 100MHZ 1GGZ Sassa

UNI-T UTD2102CEX Oscilloscope Digital Storage 1G sample rate 100MHz bandwidth

Features:

1?Dual analog channels width range 1mV/div~20V/div;

2?7 inches widescreen LCD displays;

3?The new interface style;

4?Supports plug-and-play USB storage device. Communication with and remote control of computer through the USB device;

5?USB drive system software upgrade;

6?Storage of waveforms setups and interfaces waveforms and setups reproduction;

7?Automatic measurement of 32 waveform parameters;

8?Unique waveform recording and replay function;

9?Multilingual menu displays.

Product Specifications

Specification UTD2102CEX

Channels 2

Bandwidth 100MHz

Sample Rate 1Gs/s

Rise Time =3.5ns

Memory Depth 25kpts

Waveform Acquisition Rate =2000wfms/s

Vertical Sensitivity(V/div) 1mV/div~20V/div

Timebase Range(s/div) 2ns/div~50s/div

Storage Setup,Wave,Bitmap

Trigger Modes Edge, Pluse, Video,Slope,Alternate

Interface USB OTG

General Characteristic

Power 100-240VAC, 45-440Hz

Display 7 Inches 64K Color TFT LCD, 800480

Product Color White and Gray

Product Net Weight 2.2 Kg

Product Size (WHD) 306mm 147mm 122mm

Standard Accessories Probe2 (1,10 switchable), Power Cord , USB Cable, PC Software CD

Standard Individual Packing Gift Box, English Manual

Standard Quantity Per Carton 2 PCs

Standard Carton Measurement (LWH) 450mm 420mm 280mm

Standard Carton Cross Weight 8.5 Kg

Optional Accessories*

LA Module

Package List:

1 * UNI-T UTD 2102CEX Digital Storage Oscilloscope

2 * Probe (1,10 switchable)

1 * USB Cable

1 * Power Power Cable

1 * English Manual

1 * CD Software

CH000194
284,69 €

UTD2102CEX Digital Storage Oscilloscope 100MHZ 1GGZ Sa/USB wiele języków

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i72675QM templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
5,40 €

I7-2675QM templariusz

wishlist
Compare

INTELLE82GME965 SLA9F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
22,24 €

INTELLE82GME965 SLA9F (ANG.)

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TSOP32 TSOP40 TSOP48 NOR Sockets dla TL866CS

1.TSOP32/40/48 Base Board

2.TSOP32/40/48 Socket Soldering top Board

3.TSOP48/SOP44 ZIF Socket top Board

4.TSOP40A Base Board,

5.TSOP40B Base Board,

6.TSOP32/40/48 Soldering top Board

CH000197
22,25 €

TSOP32 TSOP40 TSOP48 NOR Sockets dla TL866CS

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GK107250 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
5,40 €

GK107-250-A2

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