• Show Sidebar

Jest 5250 produktów.

Sortuj wg:
Best sellers Dostępne Nazwa, A do Z Nazwa, Z do A Cena, rosnąco Cena, malejąco
Pokazano 1141-1152 z 5250 pozycji

Aktywne filtry

wishlist
Compare
Quickview

G86740A2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001238
5,40 €

G86-740 stencil

wishlist
Compare
Quickview

ENE KB926QF B1 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001239
3,45 €

ENE KB926QF B1 (ANG.)

wishlist
Compare
Quickview

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001240
9,82 €

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

wishlist
Compare
Quickview

NCP1200AD100

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001241
3,45 €

NCP1200AD100

wishlist
Compare
Quickview

N13EGS1A1

N13E-GS1-A1

Part Number N13E-GS1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1213

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001242
124,72 €

N13E-GS1

wishlist
Compare
Quickview

GP104140A1 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001243
17,14 €

GP104-140-A1 Stencil Template 90*90 (ang.)

wishlist
Compare
Quickview

MEC5025NU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001244
3,45 €

MEC5025-NU

wishlist
Compare
Quickview

INTELLE88CLGM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001245
14,30 €

INTELLE88CLGM

wishlist
Compare
Quickview

TPS51427AT i i

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001246
3,45 €

TPS51427AT i i

wishlist
Compare
Quickview

MCP67

MCP67MV-A2

Part Number MCP67MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001247
73,85 €

MCP67MV

wishlist
Compare
Quickview

VP598 – Auto ECU Chip Tunning Auto Programming Tool

Login to Download: * User Manual Items List

Features:

? 48 Pin ZIF socket with Popular pin-drivers.

? Interface with LAPTOP, PC or compatibles through USB port

? Accepts standard file formats: JEDEC, INTEL (Extended) HEX, HOLTEK, EMC(.CDS), INTEL HEX16, Motorola S record

? Manages 16 and 32-bit word split (Set Programming)

? Features Test Vector capability and multiarray fuse map editor

? Test TTL/CMOS logic ICs and Dynamic/Static Random Access Memory devices

? Optimum programming for each individual device

? Automaticly Identifies the manufacturer and type of E(E)PROMs, Auto identifies TTL/CMOS logic IC

? Device insertion and poor-pin-contact check

? Support 1.5v Low voltage devices

? Not need exterior adapter for mostly devices.

? Universal DIP, PLCC, QFP, TSOP, PSOP, SOIC, SSOP, SDIP adapters

? Auto-run mode starts programming automatically upon detection of chip insertion

? Supports WindowsXP/Vista/ Windows 7 (32bit and 64bit)/ Windows 8 (32bit and 64bit)

? Supports ten languages, such as Chinese(Simplified), Chinese(Traditional), English, Korean, Poland, Italian, Portuguese, Dutch, Turkish and Hungary.

Specification:

? Dimension: 1689823mm

? weight: 265g

? Electrical spec. of the AC adapter: AC input 100V to 240V, 50/60Hz, DC output 9V/0.6A

Device Support:

? PROM: N/CMOS E(E)PROM, SeriesE(E)PROM, and FLASH Memory

? PLD: CPLD, EPLD, GAL, PEEL, PALCE and more

? Microcontroller: Atmel, Intel, Microchip, Signetics, Zilog, etc.

IC Test:

? TTL (74 series), CMOS (40/45 series) Logic IC

? DRAM SRAM memory device

Package Including:

1pc x Wellon Programmer VP-598

1pc x USB cable

1pc x VP-598 Manual

1pc x power adapter

CH001248
202,64 €

VP598 – Auto ECU Chip Tunning Auto Programming Tool

wishlist
Compare
Quickview

GMT G966125

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001249
3,45 €

GMT G9661-25ADJF11U

G86740A2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001238
5,40 €

G86-740 stencil

wishlist
Compare

ENE KB926QF B1 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001239
3,45 €

ENE KB926QF B1 (ANG.)

wishlist
Compare

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001240
9,82 €

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

wishlist
Compare

NCP1200AD100

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001241
3,45 €

NCP1200AD100

wishlist
Compare

N13EGS1A1

N13E-GS1-A1

Part Number N13E-GS1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1213

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001242
124,72 €

N13E-GS1

wishlist
Compare

GP104140A1 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001243
17,14 €

GP104-140-A1 Stencil Template 90*90 (ang.)

wishlist
Compare

MEC5025NU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001244
3,45 €

MEC5025-NU

wishlist
Compare

INTELLE88CLGM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001245
14,30 €

INTELLE88CLGM

wishlist
Compare

TPS51427AT i i

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001246
3,45 €

TPS51427AT i i

wishlist
Compare

MCP67

MCP67MV-A2

Part Number MCP67MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001247
73,85 €

MCP67MV

wishlist
Compare

VP598 – Auto ECU Chip Tunning Auto Programming Tool

Login to Download: * User Manual Items List

Features:

? 48 Pin ZIF socket with Popular pin-drivers.

? Interface with LAPTOP, PC or compatibles through USB port

? Accepts standard file formats: JEDEC, INTEL (Extended) HEX, HOLTEK, EMC(.CDS), INTEL HEX16, Motorola S record

? Manages 16 and 32-bit word split (Set Programming)

? Features Test Vector capability and multiarray fuse map editor

? Test TTL/CMOS logic ICs and Dynamic/Static Random Access Memory devices

? Optimum programming for each individual device

? Automaticly Identifies the manufacturer and type of E(E)PROMs, Auto identifies TTL/CMOS logic IC

? Device insertion and poor-pin-contact check

? Support 1.5v Low voltage devices

? Not need exterior adapter for mostly devices.

? Universal DIP, PLCC, QFP, TSOP, PSOP, SOIC, SSOP, SDIP adapters

? Auto-run mode starts programming automatically upon detection of chip insertion

? Supports WindowsXP/Vista/ Windows 7 (32bit and 64bit)/ Windows 8 (32bit and 64bit)

? Supports ten languages, such as Chinese(Simplified), Chinese(Traditional), English, Korean, Poland, Italian, Portuguese, Dutch, Turkish and Hungary.

Specification:

? Dimension: 1689823mm

? weight: 265g

? Electrical spec. of the AC adapter: AC input 100V to 240V, 50/60Hz, DC output 9V/0.6A

Device Support:

? PROM: N/CMOS E(E)PROM, SeriesE(E)PROM, and FLASH Memory

? PLD: CPLD, EPLD, GAL, PEEL, PALCE and more

? Microcontroller: Atmel, Intel, Microchip, Signetics, Zilog, etc.

IC Test:

? TTL (74 series), CMOS (40/45 series) Logic IC

? DRAM SRAM memory device

Package Including:

1pc x Wellon Programmer VP-598

1pc x USB cable

1pc x VP-598 Manual

1pc x power adapter

CH001248
202,64 €

VP598 – Auto ECU Chip Tunning Auto Programming Tool

wishlist
Compare

GMT G966125

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001249
3,45 €

GMT G9661-25ADJF11U

wishlist
Compare
Back to top